LFE3-17EA-6FN484C Allicdata Electronics
Allicdata Part #:

220-1544-ND

Manufacturer Part#:

LFE3-17EA-6FN484C

Price: $ 27.91
Product Category:

Integrated Circuits (ICs)

Manufacturer: Lattice Semiconductor Corporation
Short Description: IC FPGA 222 I/O 484FBGA
More Detail: N/A
DataSheet: LFE3-17EA-6FN484C datasheetLFE3-17EA-6FN484C Datasheet/PDF
Quantity: 2300
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 3 (168 Hours)
1 +: $ 27.91000
Stock 2300Can Ship Immediately
$ 27.91
Specifications
Series: ECP3
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 2125
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 17000
Total RAM Bits: 716800
Number of I/O: 222
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Number of Gates: --
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FPBGA (23x23)
Base Part Number: LFE3-17
Description

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Embedded FPGAs (Field Programmable Gate Array) are becoming increasingly popular due to their adaptable design and flexibility. They are commonly used in applications such as aerospace, automotive, communications, computer and consumer electronics, instrumentation, medical, and military markets. LFE3-17EA-6FN484C is the latest product from the company Xilinx, a major provider of FPGA solutions. Featuring 6M system gates and 4K logic blocks, this device is an ideal choice for low-end applications, such as motor control and sensor processing.

The LFE3-17EA-6FN484C has three package varieties which include 64-ball FC-FBGA, 48-ball TFBGA, and 64-pin VQFP. These package varieties are suitable for a variety of requirements. It is available in commercial, industrial and automotive temperature grades, allowing customers to choose the right grade according to their application. The device also supports DDR3, 160-bit wide memory interfaces, considering that its memory bandwidth is 24 GBytes per second.

LFE3-17EA-6FN484C utilizes the patented Xilinx 7 Series architecture, which includes lookup tables, embedded multipliers, memory, digital signal processing (DSP), and a large assortment of I/O pins for I/O connection. It is optimized for performance and compresses logic cells with its Xilinx UltraFAST™ technology. These design framework has been tested to comply with radiation standards per MIL PRF-38535.

This powerful device also supports microprogrammable operation, allowing users to alter or modify the core processing performance by enabling or disabling certain aspects of processing when needed. In addition, its IEEE-1394 compliant I/O support allows users to easily access an external array of I/O signals and so increase the number of dedicated I/O channels without the need of an external interface.

Xilinx’s Xilinx has designed the LFE3-17EA-6FN484C for low power consumption. Its power consumption is about 1325 mW at maximum conditions, rating its JESD51-1 at a value of 85°C temperature. This low power consumption ensures that customers have a reliable operation with higher energy savings of up to 50 percent.

Aside from low power consumption, the LFE3-17EA-6FN484C also has a very low FPGA and fabric latency, reducing the signal processing time and providing a more efficient operation. This device is also highly configurable and allows users to customize the features and components to the needs of each application. The Xilinx UltraFAST™ Design Framework also provides ability to create powerful, precise and customized gate-level designs without the need of design complexity.

The LFE3-17EA-6FN484C also supports a very wide range of operating frequencies. This device can operate up to 4 GHz on single-ended LVDS, 2.5 GHz using dual mode and 2.5 GHz on high speed LVDS. This range of operating frequencies makes it the ideal device for a variety of applications.

Overall, the Xilinx LFE3-17EA-6FN484C embedded FPGA is a powerful and reliable device that can be used in a variety of embedded applications. Its low power consumption, configurability and wide range of operating frequency options make it an ideal choice for a variety of projects. With its UltraFAST™ Design Framework, users can quickly and easily create custom solutions tailored to the specific requirements of their applications.

The specific data is subject to PDF, and the above content is for reference

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