LM48901SQ/NOPB Integrated Circuits (ICs)

LM48901SQ/NOPB Application Field and Working Principle

The LM48901SQ/NOPB is an audio linear amplifier manufactured by Texas Instruments. It is designed to provide a balance between high performance and low cost. The amplifier is designed to drive loudspeakers and headphones in portable audio systems. It has a bridge-tied load (BTL) architecture that enables it to operate in both single-end and balanced-output configurations to provide high power audio operating up to 1.2W.

The LM48901SQ/NOPB is designed to drive speakers and headphones in portable audio systems. It operates on the principle of bridged-tied load (BTL). This architecture allows the amplifier to operate in both single-end and balanced-output configurations. This enables it to deliver high power to low impedance loads such as low frequency bass speakers.

The LM48901SQ/NOPB is a two-stage amplifier. The first stage is a Class AB differential voltage amplifier, which provides high performance on both AC and DC signals. The second stage contains a variable gain operational amplifier (VVA), which provides variable gain for controlling the output level. Additionally, the amplifier features a built-in selectable output power limiting. This allows the system to reduce the output power for low output loads, helping to protect the system from overloads.

The LM48901SQ/NOPB is designed to operate with a single power supply from 2.7V to 5.5V. It has a power supply rejection (PSRR) of 85dB, which helps it to reject any unwanted noise from the power source. The amplifier can operate over a temperature range of -40°C to 85°C and is protected against short-circuit conditions.

The LM48901SQ/NOPB is suitable for use in audio equipment such as mobile phones, tablet computers, notebook PCs, car audio systems, portable audio players and other portable audio systems. It can be used in both single-ended and bridge configurations, making it suitable for use in a variety of audio applications. Additionally, it is available in 6-bump wafer-level chip-size packages (WCSP), making it easy to integrate into portable audio systems.