LMZ31710RVQT

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1. Description

The LMZ31710RVQT power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. The device achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

2. Features

    1. Complete integrated power solution

        – Small footprint, low-profile design

        – Pin compatible with LMZ31707 and LMZ31704

        – 10-mm × 10-mm × 4.3-mm package

    2. Efficiencies up to 95%

    3. Eco-Mode™ and light load efficiency (LLE)

    4. Wide-output voltage adjust 0.6 V to 5.5 V, With 1% reference accuracy

    5. Supports parallel operation for higher current

    6. Optional split power rail allows input voltage down to 2.95 V

    7. Adjustable switching frequency (200 kHz to 1.2 MHz)

    8. Synchronizes to an external clock

    9. Provides 180° out-of-phase clock signal

  10. Adjustable slow start

  11. Output voltage sequencing and tracking

  12. Power-good output

  13. Programmable undervoltage lockout (UVLO)

  14. Overcurrent and overtemperature protection

  15. Prebias output start-up

  16. Operating temperature range: –40°C to +85°C

  17. Enhanced thermal performance: 13.3°C/W

  18. Meets EN55022 Class B emissions

        - integrated shielded inductor

  19. Create a custom design using the LMZ31710 with the WEBENCH® Power Designer

3. Applications

    1. Broadband and communications infrastructure

    2. Automated test and medical equipment

    3. Compact PCI / PCI Express / PXI express

    4. DSP and FPGA point-of-load applications

4. Pin Configuration 

5. Package overview