M1A3P250-2FGG144 Integrated Circuits (ICs) |
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Allicdata Part #: | M1A3P250-2FGG144-ND |
Manufacturer Part#: |
M1A3P250-2FGG144 |
Price: | $ 13.03 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Microsemi Corporation |
Short Description: | IC FPGA 97 I/O 144FBGA |
More Detail: | N/A |
DataSheet: | M1A3P250-2FGG144 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
160 +: | $ 11.84530 |
Series: | ProASIC3 |
Part Status: | Active |
Lead Free Status / RoHS Status: | -- |
Number of LABs/CLBs: | -- |
Moisture Sensitivity Level (MSL): | -- |
Number of Logic Elements/Cells: | -- |
Total RAM Bits: | 36864 |
Number of I/O: | 97 |
Voltage - Supply: | 1.425 V ~ 1.575 V |
Mounting Type: | Surface Mount |
Number of Gates: | 250000 |
Operating Temperature: | 0°C ~ 85°C (TJ) |
Package / Case: | 144-LBGA |
Supplier Device Package: | 144-FPBGA (13x13) |
Base Part Number: | M1A3P250 |
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Embedded - FPGAs (Field Programmable Gate Array)
The M1A3P250-2FGG144 is a type of embedded Field Programmable Gate Array (FPGA). Such devices are used to build both simple and complex logic systems, and offer an exceptionally flexible platform for a wide variety of applications. An M1A3P250-2FGG144 is particularly well-suited for power electronics applications due to its thermal and electrical characteristics, as well as its high integration level.
FPGAs consist of multiple logical elements connected together, such as logic gates, flip-flops, and combinational blocks. These elements are configured by the user to form a custom logic system. This flexibility gives FPGAs the ability to quickly adapt to many different applications for a multitude of applications.
An M1A3P250-2FGG144 is composed of two main elements – the FPGA core and the power suite. The core consists of a two-level programmable Logical Element Array (LEA), four programmable signal routing blocks (Memory Segment Blocks, also known as MSBs), and twelve programmable signal routing blocks (also known as Core Inputs). The power suite consists of a signal transmission driver (TD), a power management fan out block (PMFOB), and a clock driver (CD).
An M1A3P250-2FGG144 is a low-power embedded FPGA, offering users a robust thermal and electrical performance, as well as a high level of integration. This device is extremely well-suited for applications requiring comprehensive functional and logic projects, such as power control and signal management.
An M1A3P250-2FGG144 is capable of operating at very low voltages and low temperatures, while still maintaining reliable operation. The device is equipped with an advanced power-saving architecture, which allows it to dynamically adjust its power consumption to ensure maximum efficiency and performance.
The device also features a wide range of customizable logic functions, such as counter/timers, serializers/deserializers, and logic gates, making it easy for users to create custom logic systems for their applications. The device also provides advanced signal processing capabilities, enabling users to quickly and easily integrate analog and digital signals.
The M1A3P250-2FGG144 also features a variety of other features, including two multi-voltage I/O banks, which enable it to support different voltages, as well as multiple synchronous clock domains. Additionally, the device includes an integrated clock multiplier, which allows it to operate at multiple clock speeds. Finally, the device includes an integrated temperature sensor, allowing users to monitor the device temperature and adjust its power consumption accordingly.
The M1A3P250-2FGG144 is a powerful, low-power embedded FPGA, which can be used in a wide variety of applications. With its advanced features and thermal and electrical characteristics, this device is an ideal solution for embedded applications, power electronic applications, and digital signal processing.
The specific data is subject to PDF, and the above content is for reference
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