M1A3PE3000-2FGG324I Allicdata Electronics
Allicdata Part #:

M1A3PE3000-2FGG324I-ND

Manufacturer Part#:

M1A3PE3000-2FGG324I

Price: $ 263.70
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 221 I/O 324FBGA
More Detail: N/A
DataSheet: M1A3PE3000-2FGG324I datasheetM1A3PE3000-2FGG324I Datasheet/PDF
Quantity: 1000
84 +: $ 239.72600
Stock 1000Can Ship Immediately
$ 263.7
Specifications
Series: ProASIC3E
Part Status: Active
Total RAM Bits: 516096
Number of I/O: 221
Number of Gates: 3000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-BGA
Supplier Device Package: 324-FBGA (19x19)
Base Part Number: M1A3PE3000
Description

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Embedded - FPGAs (Field Programmable Gate Array)

The M1A3PE3000-2FGG324I is an example of one of the newer generations of embedded Field Programmable Gate Array (FPGA) devices being used in technology solutions throughout the world. This FPGA is a chip-level technology, which means that a single chip houses an array of programmable logic gates. It is, therefore, distinguished from other types of programmable logic devices by its ability to be reprogrammed, allowing it to easily adapt to changing customer requirements. A major development as far as FPGAs are concerned is their use in on-chip embedded processing environments. Each FPGA contains an array of configurable logic blocks, routing resources and programmable interconnect. When combined, these elements form a complex reconfigurable system, which can be used to create custom logic solutions. The logic blocks themselves contain logic gates, which can be programmed to perform certain functions.

The FPGA is highly adaptable, enabling the customer to choose a variety of configurations. Its configurable nature allows the FPGA to be tailored to each customer’s exact requirements. This flexibility can be especially useful in situations where customer requirements are likely to change over time. For example, in the case of embedded processing, the FPGA can be used as an adaptable platform, allowing for the addition and removal of logic blocks or resources depending on the customer’s needs.

The FPGA also has a wide range of applications. In addition to being used in embedded processing environments, FPGAs can be used to create high-performance computing platforms, multimedia solutions, communications networks, and image processing solutions. They can also be used to create custom logic solutions, such as logic boards, data acquisition devices, and simulation boards. The FPGA is typically manufactured using an extremely advanced fabrication process. This process involves depositing a large number of active elements onto a single chip, which creates an extremely dense array of logic gates. The FPGA can then be assembled using a variety of techniques, including chip-level assembly, micro assembly and System-On-Chip (SoC) assembly.

The primary benefit of the FPGA is its reconfigurability. This feature allows the user to modify the chip’s logic circuitry on-the-fly, allowing for quick and seamless adaptation to changing customer needs. Additionally, this makes the FPGA a very efficient technology, allowing for the creation of multiple custom solutions from a single chip. The FPGA is also highly reliable and is well-suited for a variety of high-reliability applications. The M1A3PE3000-2FGG324I is an example of a modern FPGA that is making a wide range of technology solutions possible. This highly adaptable and reliable chip is being used in embedded processing environments as well as in high-performance computing platforms, multimedia solutions, communications networks and image processing solutions. This FPGA is just one example of how this chip-level technology is making it possible to create custom solutions in a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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