MAX8582ETB+T RF/IF and RFID

Series:	--
Packaging:	Tape & Reel (TR)
Part Status:	Active
Function:	Downconverter
Frequency:	2.5MHz, 1.5MHz
RF Type:	Cellular, CDMA
Secondary Attributes:	60MOhm Bypass in TDFN
Package / Case:	10-WFDFN Exposed Pad
Supplier Device Package:	10-TDFN-EP (3x3)

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IntroductionThe MAX8582ETB+T is a highly integrated, single-chip chipset designed for use in a variety of RF applications. It combines the features of two System-on-Chip (SoC) devices into one integrated package, saving space, power, and cost. The device features a wide range of programmable settings, making it suitable for connectivity in a variety of wireless communications systems.Application FieldThe MAX8582ETB+T is designed to be used in a variety of applications, including point-to-point radios, cellular base stations, portals, and multiple-input multiple-output (MIMO) systems. Furthermore, it is designed for use in both indoor and outdoor applications, providing superior performance in all kinds of environments.The MAX8582ETB+T has been used in many different applications, such as fixed wireless access (FWA) systems, operating in the sub-6GHz and mmWave bands. The device has been deployed in public safety and military networks, as well as in mobile and satellite backhaul systems. As the demand for higher data rates and longer range is increasing, the MAX8582ETB+T is becoming increasingly popular.Working PrincipleThe MAX8582ETB+T is a two-chip SoC chipset. It is designed to simplify the design process for wireless communication systems, saving time and money. The device features a high-performance dual-core processor, which is capable of handling multiple wireless protocols. It also features integrated RAM, Flash memory, and a wide variety of analog and digital peripherals, including an 8-bit analog-to-digital convertor (ADC).Furthermore, the device has integrated radio frequency (RF) circuitry, providing a complete RF signal path from the antenna to the digital baseband processor. The MAX8582ETB+T features a dual-band synthesizer, modulation hardware, a linear power amplifier (LPA), a low-noise amplifier (LNA), and an RX signal path. The device also has an embedded PA/LNA controller, allowing it to dynamically adjust the power level of the transmit and receive signals.ConclusionThe MAX8582ETB+T is a highly integrated, single-chip chipset specifically designed for use in a variety of applications. It combines two System-on-Chip (SoC) devices in one package, saving space, power, and cost. The device features a high-performance dual-core processor, integrated RAM, Flash memory, and a wide variety of peripherals, as well as a complete RF signal path. The MAX8582ETB+T has been used in a variety of RF applications, including point-to-point radios, cellular base stations, portals, and MIMO systems. It is suitable for both indoor and outdoor applications, providing superior performance in all types of environments.

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