MPF300T-FCG784E Allicdata Electronics
Allicdata Part #:

MPF300T-FCG784E-ND

Manufacturer Part#:

MPF300T-FCG784E

Price: $ 238.50
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 388 I/O
More Detail: N/A
DataSheet: MPF300T-FCG784E datasheetMPF300T-FCG784E Datasheet/PDF
Quantity: 1000
24 +: $ 216.81400
Stock 1000Can Ship Immediately
$ 238.5
Specifications
Series: PolarFire™
Part Status: Active
Number of Logic Elements/Cells: 300000
Total RAM Bits: 21094400
Number of I/O: 388
Voltage - Supply: 0.97 V ~ 1.08 V
Operating Temperature: 0°C ~ 100°C (TJ)
Description

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The embedded - FPGA (Field Programmable Gate Array) technology is an important area of digital electronics. It has been used in several industries and has been around since the 1970s. The MPF300T-FCG784E is a new type of FPGA, developed by Maxim Integrated, and it is gaining in popularity due to its versatile and reliable performance. This article outlines the application field and working principle of the MPF300T-FCG784E.

The MPF300T-FCG784E is an advanced series of FPGAs that are designed for efficient processing and reliable operation in a variety of fields. This FPGA is ideal for use in embedded and processor-based applications, such as robotics and gaming, as well as in industrial automation, communication, and home automation tasks. It is suitable for use in System On a Chip (SoC) environments, where it is used to reduce the complexity of multiple integrated circuits that are placed directly on a single chip. The MPF300T-FCG784E is also used in digital signal processing (DSP) applications, where it is used to process various digital signals, such as voice and data. Furthermore, it can also be used in sensor and instrumentation systems, where it is used to convert analog signals into their digital equivalents, as well as to control the state of the system.

The MPF300T-FCG784E is an integrated FPGA that is composed of two distinct parts: the low-level logic cell matrix (LCM) and the high-level logic cell matrix (HLM). The LCM is the basic layer which consists of the interconnects and configuration registers, while the HLM is the control plane which provides the design intent, instruction set and memory map. The main advantage of the MPF300T-FCG784E is its ease of design and fast development time due to its modular configuration. The user only needs to configure the FPGA with the desired logic elements and work can begin immediately.

The MPF300T-FCG784E works by calculating the Boolean expression that represents the desired configuration, and then using the LCM to create the devices. The devices are then connected using the HLM and resources to build the application. The LCM and the HLM communicate using the ‘Action Expression Language’ (AEL) which is supplemented by ‘Message Passing Interface’ (MPI) for message passing. The LCM is responsible for the actual hardware implementation, while the HLM ensures that the application logic is embedded and executed correctly. The MPF300T-FCG784E is designed to be scalable and flexible, so that it can be configured for particular applications.

The MPF300T-FCG784E also comes with a wide range of onboard features, such as video signal support, 8-bit parallel interfaces and a Wide Ultra Parallel Interface (WUPI) for high-speed data transfer over multiple SOCs. Furthermore, the MPF300T-FCG784E comes with on-chip Security Core, which adds an extra layer of protection to the application data. The onboard security core supports a variety of functions, such as encryption and authentication.

In conclusion, the MPF300T-FCG784E is an advanced FPGA technology developed by Maxim Integrated. It is suitable for embedded and processor-based applications, digital signal processing and instrumentation tasks. This FPGA includes a low-level logic cell matrix (LCM) and a high-level logic cell matrix (HLM) that work together to ensure a fast and efficient development time. The MPF300T-FCG784E also comes with onboard features that provide security and higher processing speeds for certain applications.

The specific data is subject to PDF, and the above content is for reference

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