Allicdata Part #: | 568-4085-ND |
Manufacturer Part#: |
OM7603/BGA2031 |
Price: | $ 116.95 |
Product Category: | RF/IF and RFID |
Manufacturer: | NXP USA Inc |
Short Description: | EVAL BOARD FOR BGA2031 |
More Detail: | N/A |
DataSheet: | OM7603/BGA2031 Datasheet/PDF |
Quantity: | 1000 |
2 +: | $ 106.31200 |
Series: | -- |
Part Status: | Active |
Type: | Amplifier |
Frequency: | 1.8GHz |
For Use With/Related Products: | BGA2031 |
Supplied Contents: | Board(s) |
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RF Evaluation and Development Kits, Boards are used to check the performance of devices that use radio frequency signals. One such example is the OM7603/BGA2031, which is a single-chip Quad-band GSM/GPRS transceiver module. It is used to transmit and receive data between a mobile device and a base station, and is typically used in cellular phones. This article will look at the application field and working principle of the OM7603/BGA2031.
The OM7603/BGA2031 is a highly integrated device that includes both the radio frequency (RF) transceiver and the baseband processor. This simplifies the design of systems that require a low complexity RF component. It can be used in many applications such as in portable phones, data cards, personal digital assistants (PDAs), automotive tracking systems, machine type communications (MTCs), and Embedded-SIM (e-SIMs).
In addition to being highly integrated, the OM7603/BGA2031 also offers a comprehensive set of functions. It supports EDGE/GSM/GPRS, and supports data rates of up to EDGE Class 12 (up to 14.4 kbps). It has a low power consumption and a high sensitivity, making it suitable for a variety of applications. In addition, it incorporates digital signal processing (DSP) functions such as echo cancellation, voice recognition, and noise filtration.
In terms of its physical layout, the OM7603/BGA2031 is a single-chip transceiver with an integrated power amplifier. It consists of four main components – an embedded DSP, radio frequency (RF) section, analog-to-digital and digital-to-analog converters, and a power supply. All these components are mounted on a ceramic ball grid array (BGA) package. The advantage of this type of package is that it provides improved thermal performance and high level of integration.
The working principle of the OM7603/BGA2031 is fairly simple. The RF section contains the transmit and receive antennas, the filters, the frequency divider, the voltage-controlled oscillator (VCO), the power amplifier, and the low noise amplifier (LNA). All these components work together to modulate and demodulate the radio frequency signal. On the other side of the device, the embedded DSP processes the digital signal, which is then converted to analog form by the analog-to-digital and digital-to-analog converters, and finally sent out to the power amplifier.
The OM7603/BGA2031 is an excellent choice for a wide range of applications that require a low complexity RF component. With its integrated power amplifier, low power consumption, and high sensitivity, it is well suited for use in portable phones, data cards, PDAs, automotive tracking systems, MTCs, and e-SIMs. In addition, its BGA packaging offers improved thermal performance and a high level of integration, making it easy to design a system that requires little complexity or space.
The specific data is subject to PDF, and the above content is for reference
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