Allicdata Part #: | OMAP2531BZAC400-ND |
Manufacturer Part#: |
OMAP2531BZAC400 |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Texas Instruments |
Short Description: | IC MICROPROCESSOR 80TQFP |
More Detail: | Microprocessor IC * |
DataSheet: | OMAP2531BZAC400 Datasheet/PDF |
Quantity: | 1000 |
Series: | * |
Part Status: | Active |
Package / Case: | -- |
Supplier Device Package: | -- |
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The OMAP2531BZAC400 is an embedded microprocessor system designed for use in multiple applications. It is capable of powering low-powered and high-volume applications. It is an integrated product that uses an ARM Cortex-A15 processor core, Memory Subsystem, Peripheral interface Subsystem, integrated Power Management, and an array of Communications Interfaces. The OMAP2531BZAC400 uses a Coreplex A15 with a Cortex-A15 processor core as its foundation. It has no dedicated external memory and uses only the integrated on-chip systems or external DRAM or NAND Flash memory as its main memory. The on-chip Memory Subsystem consists of L2 Cache, tightly coupled Memory (TCM or fast SRAM) that is dedicated to the processor core. It also features various peripherals, such as GPIO, UART, MDIO, SPI, I2C and USB.
The Coreplex A15 is the latest Cortex-A15 core from ARM. It is capable of up to 1.3GHz frequency at 1.2V. It has 32KB Level 1 instruction cache, 32KB Level 1 data cache, and a unified 1MB Level 2 cache. It also has an advanced vector extension with enhanced single instruction, multiple data capabilities and Neon support for multimedia applications. The OMAP2531BZAC400 supports 32- and 64-bit operations and can run Linux, Windows Embedded CE and Android operating systems.
The Memory Subsystem is a tightly coupled subsystem that provides centralized access to all external memory and peripheral resources. It supports multiple SDRAM and NAND Flash interfaces, and provides three levels of memory protection. Additionally, it features various memory protection features, such as read/write protection, exec/write protection, user access permission, and secure boot support. All external memory access is managed through memory controllers, which can be configured to access multiple banks, and it supports a wide range of SDRAM architectures, including DDR3, DDR2 and DDR. The integration of the Memory Subsystem results in reduced device power consumption, as the on-chip memory is always powered.
The Peripheral Interface Subsystem is designed to provide a comprehensive range of interfaces to facilite integration of system components. It supports multiple interfaces, including UART, I2C, SPI, MDIO, TDM, GPIO (general purpose input/output) and USB. The subsystem can be configured to support multiple communication protocols, such as USB, Bluetooth and Ethernet. Additionally, it supports various peripherals, such as audio codec and Wi-Fi. This subsystem also supports an integrated power management unit, which provides low-power frequency and voltage-scaling, as well as low-power sleep modes. This power management unit is also used to manage power consumption during idle, sleep and active modes.
The OMAP2531BZAC400 also features an array of communication interfaces, such as Bluetooth and Wi-Fi, to enable wireless communication between systems. These interfaces are supported by their own dedicated microprocessors, which support various communication protocols, such as data transfer, voice, video and telephony. The Wi-Fi interface supports the 802.11a/b/g/n protocols. Additionally, the OMAP2531BZAC400 supports multiple interfaces, such as serial port, Ethernet, USB, UART and I2C, to enable communication with external devices. All these interfaces are integrated into the device to reduce the cost of external components.
The OMAP2531BZAC400 has been designed for use in low-power and high-volume applications. It is suitable for applications that require frequent and low-power communications, such as automotive, healthcare and industrial. It is also suitable for applications that require secure data transfer and secure boot support, such as embedded systems and industrial control systems. Additionally, it can be used for embedded systems, such as gaming and 3D imaging, due to its low-power and integrated features. Furthermore, it is also well-suited for applications requiring an advanced multimedia platform, thanks to its integrated audio codec, Wi-Fi and Bluetooth support. Finally, it is also suitable for applications requiring secure power management, thanks to its integrated power management unit.
The specific data is subject to PDF, and the above content is for reference
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