P4KE550-E3/54 Circuit Protection

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1. FEATURES

    1. Glass passivated chip junction

    2. Available in uni-directional only

    3. Excellent clamping capability

    4. Very fast response time

    5. Low incremental surge resistance

    6. Solder dip 275 °C max. 10 s, per JESD 22-B106

2. TYPICAL APPLICATIONS

Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, and telecommunication.

3. MECHANICAL DATA

    1. Case: DO-41 (DO-204L), molded epoxy over passivated chip

    2. Molding compound meets UL 94 V-0 flammability rating

    3. Base P/N-E3 - RoHS-compliant and commercial grade

    4. Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102

    5. E3 suffix meets JESD 201 class 1A whisker test

    6. Polarity: color band denotes cathode end

4. APPLICATION NOTES

    1. Respect thermal resistance (PCB Layout) - as the temperature coefficient also contributes to the clamping voltage

    2. Select minimum breakdown voltage, so you get acceptable power dissipation and PCB tie point temperature. Devices with higher breakdown voltage will have a shorter conduction time and will dissipate less power

    3. Clamping voltage is influenced by internal resistance - design approximation is 7 V per 100 mA slope

    4. Keep temperature of TVS lower than TOPSwitch® as a recommendation

    5. Maximum current is determined by the maximum TJ and can be higher than 300 mA. Contact supplier for different clamping voltage/current arrangements

    6. Minimum breakdown voltage can be customized for other applications. 

5. Pin configuration