QB1111B40ESS3

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Thermal management plays an important role in many applications, from medical and semiconductor components to machinery and electronics. Heat produced by components needs to be dissipated in order to maintain appropriate temperatures, prolong the life of components, and improve product performance. Modern thermal solutions, such as the QB1111B40ESS3, are effective and efficient at addressing heat management needs.

The QB1111B40ESS3 thermal solution is part of a highly specialized segment of the thermal management market. It is a heat sink, a device designed to transfer thermal energy away from an object or system. This thermal solution is composed of an aluminium baseplate with mounted extruded fins that passively dissipate excess heat through forced convection. It has an attachment surface of 140mm and a height of 111mm. The unit also features an integrated fan. The fan operates with 12V and 1.72w. This product is suitable for both existing and upcoming designs.

The QB1111B40ESS3 provides a highly efficient method of managing excessive thermal energy. It removes heat generated by components and transfers it away from the system, cooling the system and protecting the components from damage due to overheating. The type of heat sink, combined with the power of the integrated fan, helps augment the convective heat transfer and cooling efficiency.

The primary application field for the QB1111B40ESS3 is electronic system cooling. It is well-suited for applications with high-power components that require additional forced air cooling, such as optical storage devices, laser printers, digital signal processors, servers, LED displays, and more. This solution is also an excellent general-purpose system cooling option, capable of even heat distribution, suitable for systems that require higher-end performance. And due to its low height profile, the QB1111B40ESS3 can also be used for space-constrained and embedded applications.

The effective working principle of the QB1111B40ESS3 is based on convective heat transfer. Heat from components is dissipated through forced air convection managed by the integrated fan. Air passes through the fin system, which acts as a dissipation surface. The aluminium body also serves as an active heat absorber of thermal energy generated by components, further aiding the cooling efficiency. This combination of convective heat transfer (forced air) and conduction transfer (heat absorption) ensures a very efficient thermal solution.

The QB1111B40ESS3 is an excellent thermal solution for applications that require reliable and effective thermal management, such as servers, LED displays, and digital signal processors. Specifically designed for low-profile systems, this product offers efficient convective transfer (forced air) and conduction transfer (heat absorption) that provides effective protection against component overheating. Offering relatively low height and excellent cooling performance, the QB1111B40ESS3 is suitable for both new and existing designs.

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