QB1111B40ESTB Allicdata Electronics
Allicdata Part #:

QB1111B40ESTB-ND

Manufacturer Part#:

QB1111B40ESTB

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB1111B40ESTB datasheetQB1111B40ESTB Datasheet/PDF
Quantity: 1000
500 +: $ 2.91973
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks play a vital role in the cooling of electronic devices; they have the potential to maximize the efficiency of a product in operation. In order to benefit from thermal management, a heat sink with high thermal performance is required. The QB1111B40ESTB heat sink is a highly advanced product that offers superior thermal performance to a wide range of applications.

The QB1111B40ESTB is a type of heat sink with a multifunctional structure that helps to maintain an optimal temperature for the device in operation. The heat sink is composed of an aluminium base, an integrated mounting plate, a fin stack and two heat pipes. The heat pipes are connected to an aluminium plate featuring a series of fins in order to dissipate the excessive heat that is generated. The fin stack is designed with great precision and provides excellent thermal performance.

The thermal performance of the QB1111B40ESTB heat sink relies on its efficient dissipation property. The fins are designed so that the amount of heat dissipated is higher than what is needed to cool the device. The structure of the integrated mounting plate and aluminium base enables the heat to transfer quickly, which also allows for efficient cooling.

The QB1111B40ESTB heat sink is ideal for a wide range of applications, including servers, storage systems, personal computers, medical devices and industrial equipment. Due to its superior thermal performance, the heat sink can be used to keep the necessary components of central processing units cool. It is also perfect for use in system-on-chip applications, as it helps to keep the chip cool and prevent it from overheating.

The working principle of the QB1111B40ESTB heat sink relies on the heat pipes and fin stack to dissipate the heat generated by the device in operation. The fins are designed with great precision and help to maximize the rate of heat transfer from the device to the heat pipes. The heat is then transferred to the metal base and transferred to the surrounding air by conduction. This helps to keep the device cool while still maintaining an optimal temperature.

The QB1111B40ESTB heat sink is a highly advanced product that offers superior thermal performance to a wide range of applications. Its efficient structure helps to dissipate the excessive heat generated by the device, which helps to keep the device cool and prevents it from overheating. The heat sink is perfect for use in a variety of applications, including servers, storage systems, personal computers, medical devices and industrial equipment. With its superior thermal performance, the QB1111B40ESTB heat sink has the potential to maximize the efficiency of the product in operation.

The specific data is subject to PDF, and the above content is for reference

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