QB2525B60ESS3 Allicdata Electronics
Allicdata Part #:

QB2525B60ESS3-ND

Manufacturer Part#:

QB2525B60ESS3

Price: $ 13.62
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB2525B60ESS3 datasheetQB2525B60ESS3 Datasheet/PDF
Quantity: 1000
25 +: $ 12.25220
Stock 1000Can Ship Immediately
$ 13.62
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksThe QB2525B60ESS3 is a powerful thermal-heat sink device used in a variety of applications. Typically, the device is used in systems that require a lot of heat dissipation, such as in advanced gaming systems, high-end servers, military electronics, and other electronic equipment. There are several different versions of the device, each one having its own specific purpose and application field. The main component of the QB2525B60ESS3 is its aluminum heat sink, which is designed to dissipate large amounts of heat away from the other components of the system. It works in cooperation with a fan that is installed and operated over the heat sink, to further dissipate heat from the system. The fan is usually connected to the heat sink through a heat pipe connection, allowing the fan to make contact with the heat sink directly.The QB2525B60ESS3 has a number of features that make it stand out above other heat sinks. For one, the device is made from high-end aluminum, making it more durable than other materials used in heat sinks. Additionally, the device also features a thermal transfer plate, which acts as an air gap between the heat sink and the component that it is dissipating heat from. This makes it easier for heat to transfer from the component to the finned surface of the heat sink. The QB2525B60ESS3 also features a series of angled holes in its finned surface, which helps to improve heat transfer. These small openings allow the heat to escape through them, instead of having to travel up to the air outlet. This helps to improve the overall efficiency of the device, as the heat is continually being pushed out of the finned surface and dissipated.In addition to its cooling and heat transfer capabilities, the QB2525B60ESS3 also features a built-in anti-vibration system. This helps to reduce noise levels produced by the fan, allowing the system to run more quietly. As such, the device is ideal for systems that require a lot of cooling, but also need minimal noise output. The QB2525B60ESS3 is a powerful device that is designed for a variety of different applications. It is especially useful in systems that require a large amount of heat dissipation or which require a quiet fan operation. The device is also made from durable aluminum and features an advanced thermal transfer plate, making it ideal for high-end systems and military electronics. Lastly, the small holes in the finned surface help to further improve heat transfer, making this device an ideal choice for any application where temperature control needs to be precise.

The specific data is subject to PDF, and the above content is for reference

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