QB2525B60ESTD Allicdata Electronics
Allicdata Part #:

QB2525B60ESTD-ND

Manufacturer Part#:

QB2525B60ESTD

Price: $ 4.48
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB2525B60ESTD datasheetQB2525B60ESTD Datasheet/PDF
Quantity: 1000
1000 +: $ 4.03137
Stock 1000Can Ship Immediately
$ 4.48
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are important components in many types of electrical and mechanical devices.

The QB2525B60ESTD, manufactured by SANACE, is a high performance thermal-heat sink designed for a variety of applications. It is made of an aluminum base, a copper cold plate, and a high-temperature silicone compound designed to dissipate heat. The base is designed to provide maximum thermal conduction while still minimizing weight and allowing for ease of installation.

The QB2525B60ESTD thermal-heat sink features an efficient thermal management design. The base is designed with multiple interconnected heat pipes to provide increased heat dissipation throughout the surface area. The connecting heat pipes are constructed in an interconnected layout, so that each one is in direct contact with another heat pipe, providing the maximum thermal conduction between them. This efficient design makes the thermal-heat sink perfect for applications that require multiple heat sources.

The heat pipes themselves are made from a copper material, which provides excellent thermal conductivity. The high-temperature silicone compound between the heat sources is designed to ensure the maximum amount of heat dissipation. The copper cold plate is designed to dissipate any excess heat into its surrounding environment, ensuring that the heat source or components will not suffer from any additional thermal issues.

The QB2525B60ESTD thermal-heat sink is designed to be used in a variety of different applications. The first is in complex high-end data centers, where heat from multiple sources needs to be dissipated efficiently. The efficient design allows the heat to be spread evenly across all components, ensuring that the system as a whole runs more efficiently. It can also be used in more specialized applications, such as LED displays and military equipment, where heat is a critical factor.

In addition to these applications, the QB2525B60ESTD is also designed for use in medical equipment. It is designed to reduce the risk of excessive heat generation, ensuring that the equipment operates safely and efficiently. The numerous heat pipes also ensure that all sources of heat are dissipated in the most efficient manner possible, reducing the risk of any failures or malfunctions.

The QB2525B60ESTD is an excellent solution for a variety of different thermal management applications. It is designed with an efficient thermal management design, and is made from durable materials to ensure that it can stand up to any challenges faced in the field. The silicone compound between the heat sources ensures that a maximum amount of heat is dissipated swiftly and evenly, ensuring that the components running within the system are not subject to any additional heat-related issues.

The specific data is subject to PDF, and the above content is for reference

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