QB3725A60ESTC Allicdata Electronics
Allicdata Part #:

QB3725A60ESTC-ND

Manufacturer Part#:

QB3725A60ESTC

Price: $ 6.50
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB3725A60ESTC datasheetQB3725A60ESTC Datasheet/PDF
Quantity: 1000
250 +: $ 5.84925
Stock 1000Can Ship Immediately
$ 6.5
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are the effective way to dissipate heat generated by electronic components in order to maintain temperature stability. QB3725A60ESTC is a heat sink designed to dissipate heat at an ideal rate for various electronic components.

The design and construction of the QB3725A60ESTC is intended to optimise its performance in a number of application fields, allowing it to be used in space saving applications, and it can be used as an under-the-board solution to envolve existing space-demanding solutions. The design of the heat sink includes a unique combination of aluminium fins that allow for maximum heat dissipation, while providing a minimal parasitic resistance to the airflow. In addition to the aluminium fins, the QB3725A60ESTC also features an integrated fan for enhanced cooling capability. The fan\'s design makes it suitable for both gas-cooled as well as liquid-cooled applications.

The QB3725A60ESTC comprises of solid construction for maximum thermal insulation and offers superior corrosion resistance in the most extreme environments. Additionally, the heat sink has been optimized as to operate with minimal noise, and has a robust shock resistant design to withstand strong vibrations during mechanical operations.

The working principle of the QB3725A60ESTC is that it uses the heat of the component to cause convection current to move the air between the fins of the heat sink. The hot air is then moved by the fan to the environment, allowing for maximum cooling efficiency and reduced thermal resistance. The QB3725A60ESTC is well suited for its application in situations where fast, high power applications require optimal cooling precision and maximum heat dissipation.

Overall, the QB3725A60ESTC heat sink is a reliable, robust and efficient tool which can effectively dissipate thermal energy away from sensitive electronic components, and it provides maximum thermal insulation and long-lasting performance, which is particularly useful in applications with limited space requirements.

The specific data is subject to PDF, and the above content is for reference

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