QB3737B60WSTB Allicdata Electronics
Allicdata Part #:

QB3737B60WSTB-ND

Manufacturer Part#:

QB3737B60WSTB

Price: $ 8.46
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB3737B60WSTB datasheetQB3737B60WSTB Datasheet/PDF
Quantity: 1000
500 +: $ 7.61859
Stock 1000Can Ship Immediately
$ 8.46
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are devices that allow heat to be transferred away from high heat generating elements such as CPUs and other processors. The QB3737B60WSTB is a thermal - heat sink designed for the CPU heat dissipation needs of high-end servers and workstations. The QB3737B60WSTB is designed to provide an efficient solution for CPU cooling with its optimized fin layout and its copper-base construction.

The QB3737B60WSTB has an array of features that make it ideally suited for high-end server and workstation thermal management needs. Its optimized fin layout maximizes heat dissipation capacity and thermal performance. The QB3737B60WSTB\'s copper base construction provides excellent heat-transfer performance, ensuring maximum cooling efficiency. The QB3737B60WSTB is also designed to mount easily on the motherboard, allowing for quick and easy installation.

The QB3737B60WSTB\'s working principle is based on the simple laws of thermodynamics, which explains how heat energy is transferred. Heat energy is transferred through the QB3737B60WSTB thermal - heat sink from a higher temperature source to a lower temperature source. The heat sources are usually the CPUs and other processors in the system, while the lower temperature source is the surrounding ambient environment where the QB3737B60WSTB is installed.

The QB3737B60WSTB has a three-layer structure that helps transfer the heat more efficiently. The top layer is composed of an array of aluminum fins, spaced to ensure that they have optimal contact with the passing air. The aluminum fins help dissipate heat effectively as the air passes over them. The middle layer is composed of a copper base that spreads the heat generated by the processor over a larger area, allowing for more efficient heat transfer. The lower layer of the QB3737B60WSTB is covered with an adhesive thermal pad that helps ensure good contact with the surface it is mounted on.

The QB3737B60WSTB\'s thermal - heat sink is designed to work in tandem with fans to maximize heat transfer. The fans draw in air from the surrounding environment, and as it passes over the QB3737B60WSTB\'s aluminum fins, the air absorbs heat from the fins, allowing for the heat to be transferred away from the processor and dissipated into the surrounding environment.

In summary, the QB3737B60WSTB is a thermal - heat sink designed specifically for the needs of high-end servers and workstations. Its optimized fin layout and copper-base construction provide excellent heat-transfer performance, while its three-layer structure and adhesive thermal pad ensure good contact and heat transfer. The QB3737B60WSTB\'s working principle is based on the laws of thermodynamics, and it works together with fans to transfer heat away from the processor and out into the surrounding environment.

The specific data is subject to PDF, and the above content is for reference

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