STM32F072C8U7

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1. Describe

STM32F072C8U7 microcontrollers include a high-performance Arm®Cortex®-M0 32-bit RISC core running at up to 48 MHz, high-speed embedded memory (up to 128 KB Flash and 16 KB SRAM), and a wide range of enhanced peripherals and I/O. All devices provide standard communication interfaces (two I2C, two SPI/I2S, one HDMI CEC and four USART), one USB full speed device (no crystal), one CAN, one 12-bit ADC, one 12-bit DAC two channel, seven 16-bit timers, one 32-bit timer and one advanced control PWM timer. The STM32F072x8/xB microcontrollers operate in the temperature range -40 to +85 °C and -40 to +105 °C with a supply voltage of 2.0 to 3.6 V. A comprehensive set of power-saving modes allows the design of low-power applications. The STM32F072x8/xB microcontrollers are available in seven different packages, from 48-pin to 100-pin, and are also available in die form upon request. Depending on the device selected, different sets of peripherals are included. These features make the STM32F072x8/xB microcontrollers suitable for a wide range of applications such as application control and user interface, handheld devices, A/V receivers and digital TVs, PC peripherals, gaming and GPS platforms, industrial applications, PLCs, inverters appliances, printers, scanners, alarm systems, video intercoms and HVAC.

2. Feature

    1. Core: Arm® 32-bit Cortex®-M0 CPU up to 48 MHz

    2. remember

        – 64 to 128 KB of flash memory

        – 16 KB SRAM with hardware parity

    3. CRC calculation unit

    4. Reset and power management

        – Digital and I/O power supply: VDD = 2.0 V to 3.6 V

        – Analog supply: VDDA = VDD to 3.6 V

        – Selected I/O: VDDIO2 = 1.65 V to 3.6 V

        – Power-on/power-down reset (POR/PDR)

        – Programmable Voltage Detector (PVD)

        – Low power modes: sleep, stop, standby

        – VBAT power supply for RTC and backup registers

    5. Clock management

        – 4 to 32 MHz crystal oscillator

        – 32 kHz oscillator for RTC with calibration

        – Internal 8 MHz RC with x6 PLL option

        – Internal 40 kHz RC oscillator

        – Internal 48 MHz oscillator with automatic ext-based trimming. Synchronize

    6. Up to 87 fast I/Os

        – All mappable to external interrupt vectors

        – Up to 68 I/Os with 5V tolerant capability and 19 I/Os with independent power supply VDDIO2

    7. 7-channel DMA controller

    8. One 12-bit, 1.0 µs ADC (up to 16 channels)

        – Conversion range: 0 to 3.6 V

        – Separate analog power supply: 2.4 V to 3.6 V

    9. 1 12-bit D/A converter (with 2 channels)

  10. 2 fast low-power analog comparators with programmable inputs and outputs

  11. Up to 24 capacitive sensing channels for touch keys, linear and rotary touch sensors

  12. Calendar RTC with alarm and periodic wakeup from stop/standby

  13. 12 timers

        – A 16-bit advanced control timer for six-channel PWM output

        – 1 32-bit and 7 16-bit timers, up to 4 IC/OC, OCN, can be used for IR control decoding or DAC control

        – Standalone and system watchdog timers

        – SysTick timer

  14. Communication Interface

        – 2 I2C interfaces support Fast Mode Plus (1 Mbit/s) with 20 mA current sink, one supports SMBus/PMBus and wake-up

        – 4 USARTs supporting master synchronous SPI and modem control, two with ISO7816 interface, LIN, IrDA, auto-baud rate detection and wake-up

        – 2 SPIs (18 Mbit/s) with 4 to 16 programmable bit frames with multiplexed I2S interface

        – CAN interface

        – USB 2.0 full-speed interface capable of running from internal 48 MHz oscillator and supporting BCD and LPM

  15. HDMI CEC wakeup on header reception

  16. Serial Wire Debug (SWD)

  17. 96-bit unique ID

  18. All packaging ECOPACK®2

3. Pin configuration

4. Functional overview

The Arm® Cortex®-M0 is a generation of Arm 32-bit RISC processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced system response to interrupts. The Arm® Cortex®-M0 processors feature exceptional code-efficiency, delivering the high performance expected from an Arm core, with memory sizes usually associated with 8- and 16-bit devices. The STM32F072x8/xB devices embed Arm core and are compatible with all Arm tools and software.

The device has the following features:

    1. 16 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait states and featuring embedded parity checking with exception generation for fail-critical applications.

    2. The non-volatile memory is divided into two arrays:

        – 64 to 128 Kbytes of embedded Flash memory for programs and data

        – Option bytes The option bytes are used to write-protect the memory (with 4 KB granularity) and/or readout-protect the whole memory with the following options:

        – Level 0: no readout protection

        – Level 1: memory readout protection, the Flash memory cannot be read from or written to if either debug features are connected or boot in RAM is selected

        – Level 2: chip readout protection, debug features (Arm® Cortex®-M0 serial wire) and boot in RAM selection disabled

5. Analog-to-digital converter

The 12-bit analog-to-digital converter has up to 16 external and 3 internal (temperature sensor, voltage reference, VBAT voltage measurement) channels and performs conversions in single-shot or scan modes. In scan mode, automatic conversion is performed on a selected group of analog inputs. The ADC can be served by the DMA controller. An analog watchdog feature allows very precise monitoring of the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds.

6. Digital-to-analog converter

    1. 8-bit or 12-bit monotonic output

    2. Left or right data alignment in 12-bit mode

    3. Synchronized update capability

    4. Noise-wave generation

    5. Triangular-wave generation

    6. Dual DAC channel independent or simultaneous conversions

    7. DMA capability for each channel

    8. External triggers for conversion