| Allicdata Part #: | THGBMHG7C1LBAIL-ND |
| Manufacturer Part#: |
THGBMHG7C1LBAIL |
| Price: | $ 0.00 |
| Product Category: | Integrated Circuits (ICs) |
| Manufacturer: | Toshiba Memory America, Inc. |
| Short Description: | IC FLASH 128G MMC 153WFBGA |
| More Detail: | FLASH - NAND Memory IC 128Gb (16G x 8) MMC 52MHz ... |
| DataSheet: | THGBMHG7C1LBAIL Datasheet/PDF |
| Quantity: | 1000 |
| Series: | e•MMC™ |
| Packaging: | Tray |
| Part Status: | Active |
| Memory Type: | Non-Volatile |
| Memory Format: | FLASH |
| Technology: | FLASH - NAND |
| Memory Size: | 128Gb (16G x 8) |
| Clock Frequency: | 52MHz |
| Write Cycle Time - Word, Page: | -- |
| Memory Interface: | MMC |
| Voltage - Supply: | 2.7 V ~ 3.6 V |
| Operating Temperature: | -25°C ~ 85°C (TA) |
| Mounting Type: | Surface Mount |
| Package / Case: | 153-WFBGA |
| Supplier Device Package: | 153-WFBGA (11.5x13) |
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Memory is a crucial component of any electronic device, and THGBMHG7C1LBAIL is a type of memory module used in many modern electronic devices. THGBMHG7C1LBAIL is a high-performance memory product that provides outstanding performance and reliability for many applications. In this article, we will discuss the application field and working principle of THGBMHG7C1LBAIL.
THGBMHG7C1LBAIL modules are specifically designed for a wide range of embedded applications. They are used in industrial, automotive, medical and military applications, as well as in high-end consumer products. The module provides high-speed performance and reliability for these applications. This module is also well-suited for use in server and enterprise systems, where high performance and reliability are essential.
The module is based on sophisticated multi-bit, multi-level cell (MLC) memory technology. It provides high-speed, low-power operation for embedded applications. The module can be configured to either synchronous (SDRAM) or asynchronous (DDR) operation, depending on the application requirements. The module also supports multiple boot ROM functions, including BIOS, bootloader, and operating system.
The working principle of THGBMHG7C1LBAIL memory module is simple. The module consists of a controller, a memory array, and an interface unit. The controller is responsible for controlling the access and operations of the memory array. The memory array is where the data is stored, and the interface unit is responsible for the communication between the module and the external systems. When a read or write operation is performed, the controller assigns the currently inactive memory array to the relevant operation, allowing for reduced write latency.
The module also features a number of advanced features, such as error detection and correction, on-die termination, and temperature protection. These features ensure that the data is protected and the module is operating in an optimal condition.
In summary, THGBMHG7C1LBAIL is a high-performance memory module that is suitable for a wide range of embedded applications. It is based on advanced MLC memory technology and provides a high-speed, low-power operation. The module also features a number of advanced features for enhanced performance and reliability.
The specific data is subject to PDF, and the above content is for reference
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THGBMHG7C1LBAIL Datasheet/PDF