THGBMHG8C4LBAWR Allicdata Electronics
Allicdata Part #:

THGBMHG8C4LBAWR-ND

Manufacturer Part#:

THGBMHG8C4LBAWR

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Toshiba Memory America, Inc.
Short Description: IC FLASH 256G MMC 153WFBGA
More Detail: FLASH - NAND Memory IC 256Gb (32G x 8) MMC 52MHz ...
DataSheet: THGBMHG8C4LBAWR datasheetTHGBMHG8C4LBAWR Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: e•MMC™
Packaging: Tray 
Part Status: Active
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NAND
Memory Size: 256Gb (32G x 8)
Clock Frequency: 52MHz
Write Cycle Time - Word, Page: --
Memory Interface: MMC
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 153-WFBGA
Supplier Device Package: 153-WFBGA (11.5x13)
Description

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Memory: THGBMHG8C4LBAWR Application Field and Working Principle

THGBMHG8C4LBAWR is a non-volatile memory technology that combines a high performance 3D NAND and unique controller design to deliver unprecedented levels of read and write performance. The technology is optimized for enterprise applications such as data centers, cloud computing, and high-performance computing.

The high density, low latency, and low power nature of the technology provide performance advantages over traditional memory technologies. The technology offers up to 3X faster read and write speeds, up to 5X faster energy efficiency, and up to 10X greater capacity. These advantages are further enhanced by the addition of 4KB page reads and 128-bit error correction and correction rate technologies.

At the core of the THGBMHG8C4LBAWR technology is a 3D NAND. This type of NAND is stacked in layers, with each layer containing a single layer of transistors. This design allows greater density and increased read/write performance compared to planar NAND. In addition to the 3D NAND, the technology includes a unique controller design which further increases performance and reliability.

The controller design utilizes a segmented architecture that dynamically adjusts the block size and number of planes, allowing for higher density and faster performance. The controller also includes advanced error correction and correction rate technologies, allowing for greater data integrity, lower power consumption, and improved yield.

THGBMHG8C4LBAWR is well-suited for enterprise applications, such as data centers, cloud computing, and high-performance computing. The technology’s performance, energy efficiency, and capacity are ideal for these types of applications. In addition, the controller design delivers robust data integrity and improved yield, making the technology well-suited for use in mission-critical applications.

Overall, THGBMHG8C4LBAWR is a high performance, low latency, and low power memory technology that is optimized for enterprise applications. The technology offers increased performance, energy efficiency, and capacity compared to traditional memory technologies. The controller design also provides robust data integrity and improved yield, making the technology well-suited for mission-critical applications.

The specific data is subject to PDF, and the above content is for reference

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