Allicdata Part #: | V2136N1-F-LP-ND |
Manufacturer Part#: |
V2136N1-F-LP |
Price: | $ 0.73 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK CPU W/ADHESIVE STAMPED |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V2136N1-F-LP Datasheet/PDF |
Quantity: | 1000 |
909 +: | $ 0.65206 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum Alloy |
Material Finish: | Natural Anodized |
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A thermal-heat sink is an important device in the electronics industry that disperses heat away from sensitive components. The V2136N1-F-LP is a type of thermal-heat sink that is designed to be used in widely varied applications. This article will explain the application field and working principle of this thermal-heat sink.
The application field of the V2136N1-F-LP thermal-heat sink is for electronic power transistors and other power components. This type of thermal-heat sink is particularly suited for use in high power applications without the need for a large number of additional components or a large amount of space for the thermal-heat sink.The V2136N1-F-LP is designed with a low resistance alloy material that allows for high power dissipation and an effective thermal performance. The fins on the heat sink are placed such that air is drawn through the fins from underneath, making sure that all areas are adequately cooled. The cooling fins also ensure that some of the heat is passed back out and not trapped inside the base of the sink, keeping the components cool at all times.
The working principle of the V2136N1-F-LP thermal-heat sink is very simple. Heat is generated by the components and then transferred into the thermal-heat sink. The heat is then dispersed away from the components by air passing through the fins of the thermal-heat sink. The fins then allow the air to move over the entire surface area of the thermal-heat sink, effectively dispersing the heat away from the components.The V2136N1-F-LP thermal-heat sink is designed with an optimized heat capacity. This ensures efficient and quick thermal transfer and distribution. The passageways between the fins are designed such that air can travel in the most direct route possible, meaning minimal energy loss during the thermal transfer and distribution. The V2136N1-F-LP thermal-heat sink is also designed for low noise operations, meaning that the components remain cool with little to no noise.
In conclusion, the V2136N1-F-LP thermal-heat sink is a widely used device in the electronics industry. This thermal-heat sink is designed for use in high power applications with a low resistance alloy material and fins placed for efficient air passing. The thermal-heat sink also has an optimized heat capacity and low noise operations. The thermal-heat sink works by transferring the heat generated by the components into the thermal-heat sink and then dispersing it away from the components by air passing through the fins. This ensures that all components are kept cool and the system remains quiet.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
---|
V2136N | ASSMANN WSW ... | 0.62 $ | 1000 | HEATSINK CPU STAMPEDHeat ... |
V2136N1 | ASSMANN WSW ... | 0.76 $ | 286 | HEATSINK CPU STAMPEDHeat ... |
V2136N1-F | ASSMANN WSW ... | 0.64 $ | 1000 | HEATSINK CPU W/ADHESIVE S... |
V2136N1-F-LP | ASSMANN WSW ... | 0.73 $ | 1000 | HEATSINK CPU W/ADHESIVE S... |