V2136N1

The V2136N1 is a thermal-heat sink, designed to help dissipate heat generated by electrical components in electronic systems. By increasing the surface area of the component that is designed to dissipate the heat, the V2136N1 helps maintain the internal temperature of the system, reducing the risk of premature component failure due to heat-related issues.

The V2136N1 is typically used in applications where the controlled thermal management of the system is of paramount importance. This includes power supplies, amplifiers, switching power supplies and other electrical components that generate a significant amount of heat. It is also suitable for use in operating system fans or high-power devices such as laptop hard drives where effective cooling is necessary to keep the electronics running at an optimal level.

The V2136N1 has a three-part dissipator construction with a die-cast aluminum base and stake heat-sink clamps. It also features an extractive or convective cooling mode depending on the type of air being used in the environment. This helps ensure the dissipator remains effective and efficient within its operating environment.

The V2136N1 has a working range of -20˚C to +90˚C. It is extremely robust and has an IP65 rating, which ensures it is dust and waterproof. The dissipator operates by using coils to draw heat away from critical components and thereby controlling the temperature within the system. The coils used in the V2136N1 are made of highly conductive copper that allows for maximum heat-dissipation efficiency.

The V2136N1 is also designed with an innovative construction that reduces air-flow resistance. This helps keep air flowing over the dissipator at a more efficient rate, helping ensure the components remain cool and efficient. Additionally, the design ensures the dissipator is suitable for use in a range of applications.

The V2136N1 dissipator is a reliable and cost-effective solution for managing and controlling the internal temperature of an electronic system. It provides excellent heat-transfer capabilities and an efficient cooling system which helps to reduce the risk of component failure due to overheating. Its robust nature and dust/waterproof design mean it is suitable for a range of applications and environments.