Allicdata Part #: | V2199N1-F-ND |
Manufacturer Part#: |
V2199N1-F |
Price: | $ 0.49 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK CPU W/ADHESIVE STAMPED |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V2199N1-F Datasheet/PDF |
Quantity: | 1000 |
2112 +: | $ 0.44213 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Rectangular, Fins |
Length: | 1.378" (35.00mm) |
Width: | 0.866" (22.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum Alloy |
Material Finish: | Natural Anodized |
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Heat sinks are cooling devices used to reduce the temperature of electronic components during operation. Built with aluminum, copper or other heat conductive alloys, they absorb and dissipate heat generated by the electronic components into the surrounding air. Without a heat sink, hot spots and thermal hot spots can form on an electronic component, resulting in reduced performance, erratic behavior, and potentially shortened product life expectancy. The most common and widely used type of heat sink today is the V2199N1-F.
The V2199N1-F is a symmetrical mono-Fin heat sink with air-cooled cooling technology. It provides greater surface area to dissipate heat, allowing it to cool larger components with more efficiency. Its edge-fin design also makes it easy to install, allowing it to be mounted in any orientation. It is designed for mounting onto a PCB, either flush or hanging, making it suitable for various applications. With its integrated fan motor, it also offers flexibility in cooling solutions, enabling it to cool either devices or components within a box.
The working principle of the V2199N1-F is to absorb and dissipate heat from the source, such as a processor, memory device, or other electronic components. It utilizes air-cooled cooling technology, whereby air is forced through a fin-stack design, breaking the boundaries of the thermal boundary layer, not only providing reliable thermal protection, but also allowing for high levels of heat absorption and dissipation. Airflow is maintained through the heat sink by a properly adjusted fan motor and the resulting high-efficiency cooling. As air passes through the fins, it carries the heat away from the source, releasing it into the surrounding air.
The V2199N1-F is appropriate for applications ranging from industrial, consumer electronics, automotive, military and aerospace components. It is primarily used in cooling computer processors, memory devices, and other high-end electronics, where thermal protection is of utmost importance. The wide compatibility with voltage regulators, motor control circuits, laser diodes, and other electronics further expands its potential applications. Whether it is mounted on a printed circuit board or installed in closed boxes, the V2199N1-F is an essential heat sink.
The V2199N1-F provides a great deal of thermal protection in a variety of applications. Coupled with its increased surface area, easy installation, and its integrated fan motor, it represents the best-in-class thermally optimized heatsink solution for high-power, high-performance electronic components.
The specific data is subject to PDF, and the above content is for reference
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