| Allicdata Part #: | AE11397-ND |
| Manufacturer Part#: |
V2199N1 |
| Price: | $ 0.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | ASSMANN WSW Components |
| Short Description: | HEATSINK CPU STAMPED |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  V2199N1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 0.42210 |
| 10 +: | $ 0.40068 |
| 25 +: | $ 0.38077 |
| 50 +: | $ 0.37069 |
| 100 +: | $ 0.36565 |
| 250 +: | $ 0.34058 |
| 500 +: | $ 0.32054 |
| 1000 +: | $ 0.29049 |
| 5000 +: | $ 0.28048 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Rectangular, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 0.866" (22.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum Alloy |
| Material Finish: | Natural Anodized |
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Heat sinks have been around since the dawn of personal computing. They are used to dissipate excessive heat generated by processors, graphics cards, and other electronic components. The V2199N1 is a particularly effective type of heat sink that is designed for processor cooling.
The V2199N1 consists of three key components: the baseplate, the cooling fins, and the fan. The baseplate, which is made of copper, is attached to the processor and draws heat away from it and transfers it to the surrounding environment. The cooling fins are attached to the baseplate and dissipate the heat away from the processor more effectively. Finally, the fan draws cooler air into the heat sink, promoting the dissipation of heat faster and more efficiently.
The V2199N1 works on two fundamental principles. First, the heat it absorbs is transferred away from its source, either into the environment or into a secondary coolant such as liquid nitrogen. This is the process of thermal conduction. Second, the fan causes air to circulate around the heat sink, allowing for quicker and more efficient cooling. This is the principle of convection.
The V2199N1 is designed specifically for processor cooling and, as such, is optimized to handle the high thermal loads generated by modern processors. It can be used as a primary cooler in smaller systems or as a supplemental cooler in larger ones. It is also an excellent choice for high-end workstations and gaming PCs.
The V2199N1 is a reliable, efficient, and cost-effective cooling solution. It is easy to install and can be used with a wide variety of processors and motherboards. Moreover, it has a low profile design, which means it doesn’t take up a lot of space. These factors make it an ideal choice for those who need powerful cooling performance in a small package.
In conclusion, the V2199N1 is a highly effective cooling solution for processors. It utilizes both thermal conduction and convection to transfer heat away from the processor and into the environment. The design is optimized for efficiency, cost-effectiveness, and ease of installation. As such, it is an excellent choice for those who need efficient processor cooling in a small form factor.
The specific data is subject to PDF, and the above content is for reference
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