Allicdata Part #: | AE10822-ND |
Manufacturer Part#: |
V5629G |
Price: | $ 0.48 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD |
More Detail: | Heat Sink TO-220 Aluminum Board Level |
DataSheet: | V5629G Datasheet/PDF |
Quantity: | 3296 |
1 +: | $ 0.42840 |
10 +: | $ 0.40698 |
25 +: | $ 0.38657 |
50 +: | $ 0.37649 |
100 +: | $ 0.37139 |
250 +: | $ 0.34595 |
500 +: | $ 0.32558 |
1000 +: | $ 0.29506 |
5000 +: | $ 0.28489 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.472" (12.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.256" (6.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 40.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermagnetic heat sinks are used to dissipate the heat generated by electronics in many industries. The V5629G is a thermal-heat sink that can be used in a wide range of applications.
The V5629G thermal-heat sink has a unique structure. Its design is based on a multi-layer construction with aluminum alloy fins. This structure helps to maximize heat transfer efficiency and promote uniform cooling. The surface of the fins acts as an effective radiator to dissipate the heat.
In addition, the V5629G thermal-heat sink has a high-performance cooling system. It is equipped with a centrifugal fan that can generate up to 200 CFM of airflow. This system helps to control the overall heat level and helps to maintain the temperature within an optimal range.
The working principle of the V5629G thermal-heat sink is quite simple. Its surface acts as a radiator that absorbs the heat from the electronic components and dissipates it into the air. This process continues until the temperature inside the case is cool enough. The fan helps to draw the heated air away from the components and out of the system.
The V5629G thermal-heat sink is designed to be used in many applications. It is an ideal choice for use in high-density systems, as it provides a high level of cooling efficiency. It is also suitable for use in industrial and commercial settings that require a reliable cooling source.
The V5629G thermal-heat sink is also suitable for use in data centers. It can help to keep the server rooms cool, preventing malfunctions caused by overheating. It can also help to reduce the noise levels associated with cooling systems.
The V5629G thermal-heat sink is a versatile cooling solution that can be used in many industries. Its efficient design and cooling performance make it an ideal choice for any application where efficient heat dissipation is required.
The specific data is subject to PDF, and the above content is for reference
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