V5629W32

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	SOT-32
Attachment Method:	Bolt On and PC Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.260" (6.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	36.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

The V5629W32 application field and working principle is a great way to eliminate thermal issues and ensure efficient use of energy when using CPUs. Utilizing a thermal-heat sink, this product is designed to improve the performance of multiple CPUs, as well as reduce the risk of overheating, thus helping to preserve the lifespan of the components.The product is composed of two main components, a fan and an engineered heat sink. The fan is responsible for bringing in cool air and circulating it within the system, thus helping to keep the temperature of the air around the CPUs at a lower level. This in turn results in improved cooling performance.In order for this system to work properly, the heat sink should be placed in an area of the system where there is a very small amount of air circulation. This helps to ensure that the surface area of the heat sink is cooled off efficiently as the fan is circulating the air. Once the air has passed through the heat sink; it then needs to be directed out of the system. This is done with either a vent or an exhaust port.The heat sink itself is made of two parts; a base and a top. The base is the part responsible for actually absorbing the heat and dissipating it away from the processors. This is done with a process called conduction. Heat conduction is when heat is transferred from the processor into the heat sink molecules, thereby cooling both components.The top of the heat sink is the part responsible for dispersing the heat away from the processors, as well as helping to keep the air within the case from becoming too hot. This is done with what is known as convection. During this process, the air is heated by the heat sink molecules, and then circulated out of the vents or exhaust ports.The V5629W32 application field and working principle is a great way to eliminate thermal issues and ensure efficient use of energy when using CPUs. It is composed of two main components, namely a fan and an engineered heat sink. The fan is responsible for bringing in cool air and circulating it around the system, while the heat sink absorbs and dissipates the heat away from the processor, thus preventing any overheating issues and preserving the lifespan of the components.

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Part Number	Manufacturer	Price	Quantity	Description