Allicdata Part #: | V6534E1-T-ND |
Manufacturer Part#: |
V6534E1-T |
Price: | $ 0.25 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD |
More Detail: | Heat Sink TO-220 Aluminum Board Level, Vertical |
DataSheet: | V6534E1-T Datasheet/PDF |
Quantity: | 1000 |
1000 +: | $ 0.22655 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | PC Pin |
Shape: | Rectangular, Fins |
Length: | 0.393" (10.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.894" (22.71mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 35.20°C/W |
Material: | Aluminum |
Material Finish: | Tin |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of electronics and other machinery in today\'s modern world. Heat dissipation is an essential aspect of the design and functionality of any type of thermal system. The V6534E1-T thermal solution is designed to provide reliable cooling for any system.
The V6534E1-T is a low-profile, high-efficiency air-to-air heat sink system designed to provide reliable thermal transfer from components to the surrounding environment. It features 4 heat pipes and a flat-plate design to provide efficient heat transfer and low fan noise. The low-profile design also ensures that the device will fit into small spaces, making it ideal for applications in cramped spaces or tight quarters. The frame is made of die-cast aluminum and is designed to provide superior strength and durability in a lightweight yet strong package.
The V6534E1-T is commonly used in many different applications, including computers, networking equipment, industrial automation, telecom systems, server racks, and more. It can also be used in a number of applications that require reliable thermal transfer, such as cold storage and medical devices.
The working principle behind the V6534E1-T is simple. Heat is generated by the components and is dissipated by convection. This causes the air around the component to become hotter than the device itself. This hot air is then moved away from the component by the fan and the heat sink, allowing the cooled air to be drawn back over the component for additional cooling. The system uses the natural properties of air to transfer heat away from the device and into the surrounding environment.
The V6534E1-T is designed to be extremely efficient and highly reliable over long periods of time. The design ensures that the fan and heat sink are located in the right locations to maximize heat transfer. The fan is mounted with the frame to ensure even heat distribution and to prevent the device from overheating. The flat-plate design also ensures that the device is highly efficient, with low fan noise even under high loads.
The V6534E1-T is an excellent choice for any application requiring reliable thermal management. Its low-profile design makes it ideal for tight spaces, and its high-efficiency and low-noise design ensure that it will provide reliable and consistent cooling. It is also highly durable and as such will provide reliable performance over many years of use.
The specific data is subject to PDF, and the above content is for reference
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