V7477Y

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V7477Y Thermal - Heat Sinks

Thermal-Heat Sinks are the means used to transfer the heat generated at the source (such as a processor, or electric components) away from the source in order to improve or maintain the operational temperature of the source. Thermal-Heat Sinks offer various advantages, such as energy savings, providing a stable environment for component\'s start-up, and prolong the product life and its performance. The V7477Y Thermal-Heat Sink is a type of thermal-heat sink that provides an efficient and reliable heat transfer for many electronic components.

Application Field

The V7477Y Thermal-Heat Sink is designed and optimized to serve electronic components that require efficient heat dissipation as well as high temperature protection. Some applications of the V7477Y Thermal-Heat Sink include:

• CPUs
• Servers
• Computer systems
• Industrial equipment
• Power supplies
• Photovoltaic and solar cells
• High-power LED illumination sources

Working Principle

The V7477Y Thermal-Heat Sink is composed of two parts: a solid center core and a fin-type heat-dissipating unit. The core is made of highly thermally conductive materials, that absorbs the heat from the source. The fins themselves are made up of Longchen aluminum alloy or PC fins of superior thermal-driven properties. During the heat transfer process, the fins dissipate the heat conducted in from the core by conduction.

Also, the higher air flow rate will increase the two-phase fluid heat transfer performance. A larger air flow rate does not necessarily mean a greater cooling performance. The reason is that higher air flow rate will also cause more air to be pulled backwards from the other side, thus eating away the cooling effect from the fins. But that is not the case for the V7477Y Thermal-Heat Sink. With its optimal fin design, the V7477Y Thermal-Heat Sink is able to provide the highest cooling performance while maintaining the lowest air flow rate possible.

The V7477Y Thermal-Heat Sink also features a low profile design with well-designed grooves on the lower side, making installation easier. In addition, the air-through holes on both sides of the fins allow more air to be drawn from the adjacent environment, making the heat transfer process more effective.

In conclusion, the V74777 Thermal-Heat Sink is an efficient and reliable way for transferring heat generated from an electronic component, and its features make it a desirable solution for applications such as CPUs, servers, industrial equipment, power supplies, and more.

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