V7477ZC

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The V7477ZC Thermal-Heat Sink is a highly efficient heat transfer device designed to efficiently dissipate large amounts of heat generated by high power electronics within a wide range of electronic devices. Designed to be used in high flow, high temperature applications, the V7477ZC heat sink effectively cools hot spots, prolongs component life, reduces system down-time, and improves system stability. With a great ability to dissipate thermal energy, the V7477ZC heat sink is ideal for use in applications where space is also a consideration.

The V7477ZC heat sink consists of a single piece of heat-conductive metal that is machined and formed to create a finned surface. The fins draw heat away from the device being cooled and spread it over a very large area on the heat sink. This increases the surface area and allows the heat to dissipate quicker, working to reduce temperatures and protect sensitive equipment.

The V7477ZC heat sink is designed to be positioned in contact with the surface of the device being cooled. This ensures maximum heat transfer and efficiency is achieved. It is also important to ensure there is good contact between the heat sink and the device it is cooling; this is to ensure optimal performance and reduction in system temperatures.

The V7477ZC heat sink has an integral, secondary heat spreader or ‘cold plate’ built into the design. This is used to transport heat away from the area where it is generated. Heat is then dispersed across a greater surface area and dissipated quicker. This enhances the devices actual cooling performance.

A further feature of the V7477ZC heat sink is its ‘active cooling’ operation. This involves the use of an integrated fan that actively draws air across the entire surface of the heat sink, increasing the rate of heat dissipation. The V7477ZC thermal-heat sink is capable of using both active and passive cooling methods, depending on the application’s cooling requirements.

The V7477ZC is a highly efficient and reliable piece of equipment that is well proven in a wide range of thermal-transfer applications. It is designed to fit into a wide variety of commercial, industrial and high-power applications, such as server rooms, industrial production facilities and medical imaging equipment.

The V7477ZC’s design is based on an integrated construction that is both thermally and mechanically efficient. The heat sinks fins are produced from an aluminum alloy with a high thermal conductivity. This ensures maximum heat dissipation and a longer lasting component. The robust construction also enables it to be used in a variety of environments, including those where temperatures may reach extreme levels.

Overall, the V7477ZC thermal-heat sink is an excellent device that is designed to keep components cooled and protected. Its integral fan helps to reduce the temperature of the device being cooled, while its integrated cold plate works to disperse heat away from the area where it is generated. It is a highly efficient and reliable piece of equipment proven in a variety of industrial, commercial and high-power applications.

The specific data is subject to PDF, and the above content is for reference