Allicdata Part #: | AE10841-ND |
Manufacturer Part#: |
V8508D |
Price: | $ 0.37 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEAT SINK ANOD ALUM TO-220 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V8508D Datasheet/PDF |
Quantity: | 500 |
1 +: | $ 0.34020 |
10 +: | $ 0.32130 |
25 +: | $ 0.30517 |
50 +: | $ 0.29723 |
100 +: | $ 0.29320 |
250 +: | $ 0.27312 |
500 +: | $ 0.25704 |
1000 +: | $ 0.23294 |
5000 +: | $ 0.22491 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | PC Pin |
Shape: | Square, Pin Fins |
Length: | 0.551" (14.00mm) |
Width: | 0.551" (14.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 16.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are used in many energy efficient applications, such as computers, appliances, and electronics. They are designed to absorb and dissipate heat from electronic devices, providing a more efficient way to remove heat. The V8508D is a heat sink developed for use in applications that require thermal management. The V8508D has a number of benefits, including improved heat dissipation performance, high efficiency cooling, and improved cost effectiveness. In this article, we’ll discuss the application field and working principle of the V8508D heat sink.
Application Field
The V8508D heat sink is primarily designed for use in computer cooling applications. It is ideally suited for overclocking computers, as it provides more efficient cooling performance than traditional fans. In addition, it is compatible with many different types of cooling fans and water cooling units. It can also be used in other applications, such as gaming consoles, PC cases, and hard drives. The V8508D also offers compatibility with many components used for overclocking, such as graphics cards, motherboards, and processors.
Working Principle
The V8508D heat sink works by absorbing and dissipating heat away from the device being cooled using a combination of air and liquid. The heat sink has a large heat surface plate that is designed to provide effective heat transfer to the environment. The plate is constructed from two layers, an inner layer and an outer layer, both of which utilize aluminum fins. The inner layer is designed to absorb the heat, while the outer layer is designed to direct and dissipate the heat away from the source.
The heat sink is attached to the device being cooled using a clip, which is usually made of plastic. The clip, in turn, is attached to the case of the device. As the device heats up, the heat is absorbed by the heat sink and directed away from the device. The heat is dissipated in the surrounding environment through the fins of the heat sink. The fins are designed to be highly efficient in dissipating heat, as they increase the surface area of the heat sink. As a result, the V8508D heat sink is capable of providing excellent cooling performance, even when cooling devices with high levels of heat output.
Conclusion
The V8508D heat sink is an excellent choice for use in thermal management applications. It offers efficient cooling performance, high efficiency, and improved cost effectiveness. It is suitable for use in a wide range of applications, including computer cooling, gaming consoles, PC cases, and hard drives. Additionally, its compatibility with many components used for overclocking, such as graphics cards, motherboards, and processors make it a versatile choice. By understanding the application field and working principle of the V8508D heat sink, users can ensure they select the correct device for their cooling needs.
The specific data is subject to PDF, and the above content is for reference
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