Allicdata Part #: | AE10852-ND |
Manufacturer Part#: |
V8508F |
Price: | $ 0.32 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM WITH PIN TO-220 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V8508F Datasheet/PDF |
Quantity: | 2130 |
1 +: | $ 0.28980 |
10 +: | $ 0.27342 |
25 +: | $ 0.25981 |
50 +: | $ 0.25288 |
100 +: | $ 0.24948 |
250 +: | $ 0.23242 |
500 +: | $ 0.21874 |
1000 +: | $ 0.19823 |
5000 +: | $ 0.19139 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | PC Pin |
Shape: | Square, Pin Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 16.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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The V8508F is an advanced and effective thermal-heat sink designed to keep electronic equipment running at optimal temperatures. The heat sink is designed to dissipate heat away from sensitive components and delicate electronics, allowing for improved performance and endurance. It is widely used in a range of applications, such as plasma cutters, 3D printers, routers, grinders, and oil coolers. This article will discuss the application field and working principle of V8508F.
Application Field of the V8508F
The V8508F thermal-heat sink is commonly used for many electronic and industrial applications, most notably cutting, milling, and welding. This heat sink can be used on routers, grinders, plasma cutters, CNC mills, lasers, 3D printers, oil coolers, and heat presses. Other applications include welding equipment and other machines used for cutting, milling, or sawing. The heat sink is also designed to perform well with heat lamps and other electrical products which produce a significant amount of heat.
Working Principle of the V8508F
The V8508F is designed to dissipate heat away from sensitive electronic components that produce a substantial amount of heat. It works by utilizing thermoelectric technology to convert thermal energy into electrical energy. This process is known as Peltier cooling, which can double the cooling effect of typical heatsinks. The V8508F is designed to reduce the temperature of the motherboard or other sensitive components by as much as 30-40 degrees Celsius. It uses a passive heat transfer technique, which means that the heat sink does not require a fan to cool the components, hence reducing energy consumption and providing more efficient cooling.
The V8508F heat sink works by using an array of Peltier elements arranged in a spiral-shaped heat exchanger. Heat is transferred from the cold side of the Peltier element to the hot side, where the heat is dissipated away from the electronic components that are connected to the heat sink. The heat exchange process helps to prevent overheating and damage to delicate electronics, allowing them to operate at optimal performance levels.
The V8508F thermal-heat sink is an effective and efficient way to keep electronic components at optimal temperature. This heat sink is designed to dissipate heat away from sensitive components, allowing them to operate at their peak performance levels. It is ideal for a variety of applications, such as plasma cutters, 3D printers, routers, grinders, and oil coolers. The heat sink provides efficient cooling due to its thermoelectric technology and passive heat transfer process.
The specific data is subject to PDF, and the above content is for reference
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