XC5VLX110-3FFG676C Allicdata Electronics
Allicdata Part #:

XC5VLX110-3FFG676C-ND

Manufacturer Part#:

XC5VLX110-3FFG676C

Price: $ 1.39
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 440 I/O 676FCBGA
More Detail: N/A
DataSheet: XC5VLX110-3FFG676C datasheetXC5VLX110-3FFG676C Datasheet/PDF
Quantity: 1000
1 +: $ 1.39000
10 +: $ 1.34830
100 +: $ 1.32050
1000 +: $ 1.29270
10000 +: $ 1.25100
Stock 1000Can Ship Immediately
$ 1.39
Specifications
Series: Virtex®-5 LX
Part Status: Active
Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4718592
Number of I/O: 440
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Base Part Number: XC5VLX110
Description

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FPGA (Field Programmable Gate Array) technology has become a popular platform for embedded applications. FPGA technology is used in high-end military, aerospace and industrial applications. XC5VLX110-3FFG676C is an FPGA device from Xilinx, which has become a major player in the FPGA market. It is built using the structural Verilog-HDL (Verilog-Hardware Description Language) technology.

The XC5VLX110-3FFG676C is a high-performance, flexible, and cost-effective Field Programmable Gate Array (FPGA) device. This device is based on the Virtex5 architecture. It provides a powerful platform for embedded applications, with advanced communication, signal processing, and memory management capabilities.

The XC5VLX110-3FFG676C has numerous features, such as an extensive I/O interface, up to 1.4 million logic/I/O elements (4M4K), and up to 1.75 megabytes of SRAM. It also comes with 13 dedicated I/O banks, along with numerous options for clocking, memory, and power management.

The XC5VLX110-3FFG676C is suitable for a variety of applications, including aerospace, avionics, medical, industrial, and communication applications. It can be used for signal processing, memory management, communication interface, and other applications. In addition, it provides advanced debugging features, such as "Scan Blasting" and "Trigger Load" that allow engineers to quickly and easily debug their designs.

The working principle of XC5VLX110-3FFG676C is simple. It consists of a number of logic elements, I/O lines, and SRAM that are interconnected by a network of programmable interconnect structures. This interconnect structure is the basic building block of FPGA technology. The main components of the interconnect structure are programmable logic blocks (PLDs), interconnect resources, and logic elements.

The logic elements are the building blocks of the interconnect structure. These elements can be programmed to perform various basic logic operations, such as AND, OR, NAND, NOR, XOR, XNOR, and other operations. The I/O lines are used to interface with the external devices, and the SRAM is used to store large amounts of data.

The programmable logic blocks (PLDs) are the main elements of the interconnect structure. PLDs can be programmed to perform a variety of logic operations depending on their configuration. The interconnect resources are used to connect the logic elements, I/O lines, and SRAM. This interconnect structure forms the basis of the programmable logic devices.

The XC5VLX110-3FFG676C is a powerful and flexible FPGA device that is suitable for a variety of applications. It provides advanced debugging and communication features, as well as extensive I/O, clocking, and memory options. It is an ideal platform for embedded applications.

The specific data is subject to PDF, and the above content is for reference

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