XC6SLX16-3FT256I Allicdata Electronics
Allicdata Part #:

XC6SLX16-3FT256I-ND

Manufacturer Part#:

XC6SLX16-3FT256I

Price: $ 28.04
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 186 I/O 256FTBGA
More Detail: N/A
DataSheet: XC6SLX16-3FT256I datasheetXC6SLX16-3FT256I Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status:
Moisture Sensitivity Level (MSL):
90 +: $ 25.48980
Stock 1000Can Ship Immediately
$ 28.04
Specifications
Series: Spartan®-6 LX
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 1139
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 14579
Total RAM Bits: 589824
Number of I/O: 186
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Number of Gates: --
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)
Base Part Number: XC6SLX16
Description

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An embedded FPGA, also known as an embedded field programmable gate array (FPGA), is a type of integrated circuit (IC) designed to be programmed in the field after manufacture. Embedded FPGAs, such as XC6SLX16-3FT256I are used in a wide range of applications, from space missions, to military and aerospace applications, to automotive, commercial and industrial products.

Embedded FPGAs have several benefits over traditional FPGAs. First, today's embedded FPGAs are much lower power than traditional FPGAs. This means that designers can use them in products that have long battery life and don't need ventilation or cooling. Furthermore, this also means that embedded FPGAs can be used in products that require extreme environmental conditions and that would be damaged by traditional FPGAs. Second, embedded FPGAs also free up valuable real estate on a PCB as they can often be incorporated directly onto a board. As a result, designers do not have to account for the additional area and expense of a large IC package. In addition, embedded FPGAs can also make products more cost effective during prototyping and development, as the IC can be re-programmed instead of having to purchase a new one each time a change is made. Furthermore, these devices provide greater flexibility to make changes during the production cycle and do not incurr the higher non-recurring engineering (NRE) expense to create a new ASIC or ASSP.

Embedded FPGAs with a hardened fabric, such as XC6SLX16-3FT256I, also provide a number of advantages over traditional FPGAs with a soft fabric. First, the hardening of the logic fabric of the FPGA makes the product faster and more reliable. This is due to the hardening of the logic fabric which reduces propagation delays and noise. As a result, the chips are much more resilient to production variations and environmental conditions. Furthermore, hardening of the FPGA also reduces power consumption by reducing the leakage current of the chip. This also makes them more suitable for low power and battery operated applications. Second, the hardened fabric on these FPGAs also provides increased security. This is achieved through an additional layer of encryption which makes it more difficult to clone or modify the chip. This is especially important in security applications where the device in question must be tamper proof.

In conclusion, the XC6SLX16-3FT256I embedded FPGA is a powerful and flexible device that offers a wide range of benefits to designers and end-users. Its hardened fabric makes it faster, more reliable, and more secure than traditional FPGAs. Furthermore, it is also lower-power and takes up less space on a PCB. As a result, it is an ideal choice for a wide range of embedded applications.

The specific data is subject to PDF, and the above content is for reference

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