XC7A200T-1FBG676C Allicdata Electronics
Allicdata Part #:

122-1869-ND

Manufacturer Part#:

XC7A200T-1FBG676C

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA ARTIX7 400 I/O 676FCBGA
More Detail: N/A
DataSheet: XC7A200T-1FBG676C datasheetXC7A200T-1FBG676C Datasheet/PDF
Quantity: 53
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 4 (72 Hours)
Stock 53Can Ship Immediately
Specifications
Series: Artix-7
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 16825
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 215360
Total RAM Bits: 13455360
Number of I/O: 400
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Base Part Number: XC7A200T
Description

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Introduction The XC7A200T-1FBG676C is a leading field programmable gate array (FPGA) produced by Xilinx Inc, a globally renowned pioneer in the development and supply of advanced semiconductor and industrial products. FPGAs have traditionally been used to realize complex, system-level integration, like ASICs, with the added benefit of increased flexibility and programmability. The Xilinx XC7A200T-1FBG676C particulary offers a wide range of advantages for embedded systems. OverviewThe XC7A200T-1FBG676C is a 180nm Atrix-7 device that functions as a single-chip response to complex embedded systems. Previously, such designs often represented a “mix and match” of multiple components, such as FPGA, microprocessor, memory, programmable logic controller, communications controller and other elements, which could often be merged into a single, monolithic device. The particular FPGA designed features an array of innovative technological breakthroughs aiming to ensure efficient operation in mission-critical applications requiring utmost performance, such as those in the aerospace, automotive and defense industries. This device integrates two independent ARM cores with adaptive and configurable logic blocks (CLBs), ACAP (adaptive compute acceleration platform) and increased device-level safety features. The following review will discuss the different aspects of the XC7A200T-1FBG676C in more detail. Features$\bullet$ ARM Cores: The XC7A200T-1FBG676C provides two independent ARM Cortex-A9 processors. These ARM cores have been specifically optimized for rigorous mission-critical applications and industrial automation, offering an excellent combination of deterministic performance and low-power consumption. $\bullet$ CLBs: This device also offers a total of 6,144 configurable logic blocks (CLBs) and 8 fixed-function digital signal processing (DSP) blocks. Users can configure this FPGA to fit their specific design needs and requirements, by taking advantage of Xilinx’s intuitive Vivado digital system design suite.$\bullet$ ACAP: The device delivers the advanced compute acceleration platform (ACAP) to ensure high performance across mission-critical applications. The ACAP design paradigm takes advantage of integrated dynamic programmable acceleration engines, including the optimized high-level language architectures. The device also features UltraRAM, an advanced memory block that provides additional block RAM, high speed logic and DSP for data-intensive applications. $\bullet$ Enhanced Security: Security is a key priority for mission-critical systems and the XC7A200T-1FBG676C also includes several security features, such as anti-tamper, secure key storage and secure boot that secure the OTP memory, system registers and several other on-chip resources from physical threats. AccessingThe chipset device of the XC7A200T-1FBG676C FPGA is the primary design element for building the FPGA architecture. The device contains two ARM Cortex-A9 processors and a total of 6,144 configurable logic blocks (CLBs). The device also features an 8-pin array to interconnect digital peripherals, such as low-speed or non-configurable components, like LCDs. The FPGA is available in a 32-pin QFN package. The device\'s memory interface is divided into 12 slices, each comprising of two 16-bit DDR3 SDRAMs, three interconnecting ports, one dedicated 1GHz GTX transceiver and one AIB input/output (I/O) port. The on-chip memory includes dedicated dual-port 256kB and 512kB blocks to store serial, loadable and configurable data. The device also includes several additional resources for efficient system-level integration, such as 8-channel DMA controller, programmable interrupts, and configurable interrupt control and priority encapsulation. The device also provides an advanced thermal monitor and support for up to 32 DMA channels, making it suitable for a range of autonomous, real-time, and compute-intensive applications.ConclusionThis review has highlighted the different aspects of the XC7A200T-1FBG676C FPGA, a pioneer embedded FPGA from Xilinx. This device provides a combination of two independent ARM cores and 6,144 configurable logic blocks, a total of 8 digital signal processing blocks and an ACAP designed for mission-critical applications. The device also provides increased device-level safety features for enhanced security, as well as an 8-pin array for digital peripherals, memory interface with 12 slices and on-chip memory, and a 32-pin QFN package. As a result, the XC7A200T-1FBG676C is a leading FPGA device offering numerous advantages for embedded systems. Its innovative design makes it suitable for a variety of roles ranging from aerospace, automotive and defense applications, and industrial automation to autonomous, real-time and compute-intensive applications.

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