XC7K70T-3FBG676E Allicdata Electronics
Allicdata Part #:

122-1817-ND

Manufacturer Part#:

XC7K70T-3FBG676E

Price: $ 75.52
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 300 I/O 676FCBGA
More Detail: N/A
DataSheet: XC7K70T-3FBG676E datasheetXC7K70T-3FBG676E Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 4 (72 Hours)
1 +: $ 75.52000
10 +: $ 73.25440
100 +: $ 71.74400
1000 +: $ 70.23360
10000 +: $ 67.96800
Stock 1000Can Ship Immediately
$ 75.52
Specifications
Series: Kintex®-7
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 5125
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 65600
Total RAM Bits: 4976640
Number of I/O: 300
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Number of Gates: --
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Base Part Number: XC7K70T
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Field programmable gate arrays, or FPGAs, are semiconductor devices that consist of a large set of configurable logic elements. They have become a staple of embedded systems in many industries, including aerospace, automotive, consumer, communications and industrial. Xilinx's XC7K70T-3FBG676E FPGA is an entry-level device that provides a number of advantages over its predecessors.

The XC7K70T-3FBG676E offers some of the most advanced features available in FPGAs. It has a built-in 24x48x6-bit register file, offering improved performance over the older 12-bit register files. A larger on-chip Memory of 6.4MB enables the storage of more complex data structures, allowing more complex systems designs. The XC7K70T-3FBG676E also features a high-speed, multi-stage external memory interface and delivers high-performance at low power consumption.

The XC7K70T-3FBG676E also has an on-chip power supply and a low die area with an optimized design. This helps to reduce power consumption of the device and provide maximum efficiency. Additionally, the power consumption is reduced by using low-voltage process nodes to improve the overall device performance. The device supports a variety of high-speed interfaces including Serial Rapid IO, Non-Transparent Bridge, PCIe, PCI-X, Ethernet and USB.

The XC7K70T-3FBG676E supports a large number of peripherals including a large set of standard analog I/O channels, high-speed memory controllers, I2C, SPI, JTAG and many other interfaces. The device also features a wide array of digital signal processing (DSP) blocks allowing data processing acceleration. It supports many configuration options, such as re-configuration of digital logic blocks, memory mapping and reconfigurable clocking. The XC7K70T-3FBG676E is available in three different densities, providing customers with a range of memory resources.

The XC7K70T-3FBG676E is also optimized for use in FPGA-based control system designs. It supports intricate control algorithms, complex decision-making and real-time performance. It also offers improved device security and dependability via integrated cores and sophisticated multi-channel designs. The device also offers advanced debug and test capability through the use of a variety of different tools.

The XC7K70T-3FBG676E is an ideal solution for embedded applications that require a wide range of features in a small footprint. It offers high performance and energy efficiency, making it an excellent choice for embedded design. Its flexibility and wide range of features make the XC7K70T-3FBG676E a great choice for embedded designers who need a reliable and efficient device for their projects.

The specific data is subject to PDF, and the above content is for reference

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