XCS30-3VQ100C Allicdata Electronics
Allicdata Part #:

XCS30-3VQ100C-ND

Manufacturer Part#:

XCS30-3VQ100C

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 77 I/O 100VQFP
More Detail: N/A
DataSheet: XCS30-3VQ100C datasheetXCS30-3VQ100C Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: Spartan®
Part Status: Obsolete
Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 77
Number of Gates: 30000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)
Base Part Number: XCS30
Description

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Embedded - FPGAs (Field Programmable Gate Array) have become a popular tool for embedded system designers. It provides a flexible and fast alternative to traditional hard-coded components and architectures, allowing embedded system designers to adapt quickly to the changing requirements of their applications. The XCS30-3VQ100C is a popular high-performance FPGA device developed by Xilinx Corporation. This FPGA device is suitable for a variety of embedded systems applications. This article will provide a general overview of the XCS30-3VQ100C FPGA device, as well as a discussion of its application fields and working principle.

The XCS30-3VQ100C is a 28 nm Xilinx Spartan6 architecture field programmable gate array device with a high logic capacity of 400K logic cells, up to 18280Kbits of distributed ram, and up to 4 Mbits of block ram. These features make it well suited for high-speed embedded applications requiring large amounts of memory. The device also includes up to 302 I/O pins, and supports various I/O standards such as C2MOS, SSTL, and LVTTL. The device also supports popular high-speed differential I/O standards such as LVDS and HSTL.

The XCS30-3VQ100C is particularly suited for low-power embedded systems, as it is capable of consuming as little as 0.75W at typical operating conditions. In addition, the device supports various power down and sleep modes, further lowering its power consumption. The device also supports the industry’s popular hot-swapping feature, allowing for seamless hot-swapping of boards without system resets, and allowing for more rapid prototyping.

The XCS30-3VQ100C also provides very good system integration features. It includes an array of digital signal processors and accelerators, allowing for optimized implementations of common embedded functions. It also includes an on-chip system controller, providing an on-chip bus bridge, and providing integrated system monitoring, management and control for embedded systems. In addition, the device includes a set of hardware resources for designing hardware co-processors, allowing for the hardware acceleration of embedded functions.

The XCS30-3VQ100C FPGA device is suitable for a variety of embedded system application fields. It is commonly used in storage, communications, and medical imaging applications. It is also used in industrial automation and control, automotive, and military systems. In these applications, the device is capable of providing flexible, low-power, high-performance solutions.

The XCS30-3VQ100C FPGA device works by providing the user with a flexible programmable architecture. The device is programmed using a hardware description language (HDL), and is configured using a circuit editor. The user can program the device to perform specific tasks by creating HDL models of components, connecting them together, and then integrating them into the overall system design. In addition, the user can use the Xilinx Development Studio to program the device for enhanced performance.

The XCS30-3VQ100C FPGA device is a well-suited device for embedded applications. It provides a high level of flexibility, performance, and integration features. Its low power consumption and hot-swap capabilities make it suitable for rapid prototyping and design changes. Its wide range of application fields make it an ideal solution for various embedded systems.

The specific data is subject to PDF, and the above content is for reference

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