XCV200-6BG256C Allicdata Electronics
Allicdata Part #:

XCV200-6BG256C-ND

Manufacturer Part#:

XCV200-6BG256C

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 180 I/O 256BGA
More Detail: N/A
DataSheet: XCV200-6BG256C datasheetXCV200-6BG256C Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: Virtex®
Part Status: Obsolete
Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 180
Number of Gates: 236666
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (27x27)
Base Part Number: XCV200
Description

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XCV200-6BG256C is an embedded field-programmable gate array (FPGA), specifically designed for low-cost, low-power, and high-densitiy applications. The XCV200-6BG256C offers the advantage of being able to be configured on-the-fly for specific applications without any dedicated ASIC design. This level of flexibility and scalability allows the product to be used in a wide range of applications from small, embedded products to much larger industrial systems. In addition, the XCV200-6BG256C provides a low-power and cost-effective solution for embedded applications that require an FPGA.

The XCV200-6BG256C combines an array of FPGA logic blocks with the Flexible Logic Array (FLA) logic fabric, which provides the method to create custom architectures and applications. This high-performance logic fabric allows the XCV200-6BG256C to be configured to serve as a totally configurable and scalable embedded platform. This FPGA core provides dedicated lookup-table (LUT) fabric configuration, allowing access to the internal logic and performance of the XCV200-6BG256C. Additionally, a configurable interconnect infrastructure can be used to connect multiple FPGA cores and create a net of FPGA cores.

The XCV200-6BG256C is able to support a wide variety of applications due to its advanced architecture. The FPGA provides up to 448Kbits of single-port LUT RAM capacity and up to 6.4Mbits of dual-port SRAM capacity, along with 240Kbits of SLIM® logic resources. This number of configurable logic blocks allows for a variety of applications to be implemented on the FPGA, including image processing, data communications, multimedia, and digital signal processing systems. The FPGA also provides four high-speed SERDES (serializer/deserializer) channels that can be used for high-performance designs, as well as two phase-locked-loop (PLL) channels, allowing for fast and responsive clock control. The XCV200-6BG256C also has a total of 54 general-purpose I/O pins, making it an ideal solution for application development.

Within embedded applications, the working principle of the XCV200-6BG256C can be broken down into three main components: configuration, operation, and communication. Upon power-up, the XCV200-6BG256C will configure itself from the design data stored in the internal dual-port SRAM memory. This will be followed by an operation phase to perform the user-defined logic set, meanwhile allowing communications with any peripheral devices. This process will be performed continuously until an interrupt occurs, in which case the FPGA will be able to enter into a low power state.

The XCV200-6BG256C is a cost-effective and performance-driven field-programmable gate array that integrates high-performance embedded logic and a reliable SRAM memory. This FPGA is ideal for embedded applications thanks to its configurable logic, low power consumption, and cost-effective design. The FPGA is suitable for use in a variety of applications, from consumer electronics to industrial automation, making the XCV200-6BG256C a highly versatile embedded device.

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