Allicdata Part #: | XCV300E-6FG256C-ND |
Manufacturer Part#: |
XCV300E-6FG256C |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Xilinx Inc. |
Short Description: | IC FPGA 176 I/O 256FBGA |
More Detail: | N/A |
DataSheet: | XCV300E-6FG256C Datasheet/PDF |
Quantity: | 1000 |
Specifications
Series: | Virtex®-E |
Part Status: | Obsolete |
Number of LABs/CLBs: | 1536 |
Number of Logic Elements/Cells: | 6912 |
Total RAM Bits: | 131072 |
Number of I/O: | 176 |
Number of Gates: | 411955 |
Voltage - Supply: | 1.71 V ~ 1.89 V |
Mounting Type: | Surface Mount |
Operating Temperature: | 0°C ~ 85°C (TJ) |
Package / Case: | 256-BGA |
Supplier Device Package: | 256-FBGA (17x17) |
Base Part Number: | XCV300E |
Description
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FPGA stands for Field Programmable Gate Array and it is an integrated circuit primarily used in embedded system projects. The XCV300E-6FG256C is one such FPGA that is designed to provide flexible, high-performance and reliable solutions for various applications.
FPGAs are basically hardware implementations of logic circuits that are programmable and can be reprogrammed if needed. This makes them ideal for projects with inconsistent logic and behavior requirements. They can also be used in applications that need multiple cores of SoC or need custom logic. The XCV300E-6FG256C has a very high density, making it suitable for different types of applications.
In terms of power consumption, XCV300E-6FG256C offers low power consumption and cooling requirements which makes it ideal for applications in embedded systems. This also allows the design to be implemented with small sizes and hence suitable for mobile applications.
The XCV300E-6FG256C has various features that make it suitable for different types of applications. It offers high speed signal processing, customizable logic blocks, I/O pins and support for various CAD tools. It also has a wide operating temperature range, multiple supply voltage options and configurable timing requirements.
The working principle of the XCV300E-6FG256C can be explained in two main steps. First, the logic blocks should be programmed according to the target application requirements. This step can be done using any of the supported CAD tools. After that, the logic design will be implemented into the FPGA. The logic design can be configured to support multiple clock signals and different types of I/O pins.
The XCV300E-6FG256C has wide range of applications that make it suitable for different projects. It can be used in signal processing, data acquisition, digital control and communication applications. It can also be used in applications that require large amounts of I/O and high speed signal processing. It is also suitable for applications that need well-defined timing constraints, as the configurable logic blocks can be used to achieve precise timing.
The XCV300E-6FG256C is an ideal FPGA for embedded system projects that require low power consumption, high density and reliable solutions. Its features and working principle make it flexible and suitable for a variety of applications, from signal processing to digital control. Therefore, it can be used in a wide range of projects and applications.
The specific data is subject to PDF, and the above content is for reference
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XCV300-5FG456I | Xilinx Inc. | -- | 1000 | IC FPGA 312 I/O 456FBGA |
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XCV300-5PQ240I | Xilinx Inc. | -- | 1000 | IC FPGA 166 I/O 240QFP |
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XCV300E-6BG352C | Xilinx Inc. | -- | 1000 | IC FPGA 260 I/O 352MBGA |
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XCV300E-6BG432I | Xilinx Inc. | 0.0 $ | 1000 | IC FPGA 316 I/O 432MBGA |
XCV300E-6FG256C | Xilinx Inc. | -- | 1000 | IC FPGA 176 I/O 256FBGA |
XCV300E-6FG256I | Xilinx Inc. | 0.0 $ | 1000 | IC FPGA 176 I/O 256FBGA |
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