XCVU3P-3FFVC1517E Allicdata Electronics
Allicdata Part #:

XCVU3P-3FFVC1517E-ND

Manufacturer Part#:

XCVU3P-3FFVC1517E

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: XCVU3P-3FFVC1517E
More Detail: N/A
DataSheet: XCVU3P-3FFVC1517E datasheetXCVU3P-3FFVC1517E Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: Virtex® UltraScale+™
Part Status: Active
Number of LABs/CLBs: 49260
Number of Logic Elements/Cells: 862050
Total RAM Bits: 118067200
Number of I/O: 520
Voltage - Supply: 0.873 V ~ 0.927 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)
Description

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Field programmable gate array (FPGA) technology is an increasingly sophisticated tool for embedded computing applications. It offers flexibility, low cost, and high performance, making it the perfect choice for many different types of embedded workloads. The XCVU3P-3FFVC1517E is a high-end FPGA from Xilinx, Inc that features a number of advanced features, and is a popular choice for embedded designers. In this article, we will take a look at the application field and working principles of the XCVU3P-3FFVC1517E.

The XCVU3P-3FFVC1517E offers a wide range of features that make it ideal for embedded applications. The integrated core includes numerous high-performance analog-to-digital (ADC) and digital-to-analog (DAC) converters, allowing for fast and accurate data conversion. Additionally, the device contains four configurable high-speed SERDES interfaces, enabling it to be integrated seamlessly with high-speed data interfaces. Finally, the device offers a number of high-speed clock signals and transceivers, making it suitable for high-speed communications and networking applications.

The XCVU3P-3FFVC1517E also provides designers with a high level of programmability, allowing for the development of applications tailored to specific needs. At its heart is a 3-stage pipeline with a 32-bit in-order instruction set processor (ISP), making it well-suited to application-specific computing tasks. Additionally, its flash-based programmable logic and SRAM blocks offer a high level of customization, allowing designers to implement custom logic functions and custom peripherals as needed. In addition, the device includes an L2Cache, offering higher performance speeds and reduced latency compared to on-chip memories.

The working principles of the XCVU3P-3FFVC1517E are fairly straightforward. At its core, the device is designed to be programmed using hardware description languages (HDLs) such as Verilog or VHDL. Using HDLs, designers can specify the logic functions and behavior of the device. The HDL code is then compiled and synthesized into the device\'s hardware registers, memory blocks, and logic cells. When programmed, the device acts as an application-specific logic unit, executing the desired logic functions.

The XCVU3P-3FFVC1517E has many possible applications in embedded computing. It is well-suited to high-performance computing tasks, data acquisition and conversion, as well as high-speed communications and networking. Additionally, the programmable logic and interfacing capabilities of the device make it ideal for developing custom peripherals and custom logic functions. Finally, its high-level of programmability makes it well-suited for creating specific computing solutions tailored to specific application requirements.

In conclusion, the XCVU3P-3FFVC1517E offers a wealth of features, making it an ideal choice for embedded computing. Its integrated core provides a range of ADC and DAC converters, SERDES interfaces, and high-speed transceivers, while its programmable features enable the development of custom solutions. Furthermore, its architecture and working principles allow for the development of tailored applications. The XCVU3P-3FFVC1517E is an excellent choice for embedded computing applications.

The specific data is subject to PDF, and the above content is for reference

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