XCZU9EG-2FFVB1156E Allicdata Electronics
Allicdata Part #:

XCZU9EG-2FFVB1156E-ND

Manufacturer Part#:

XCZU9EG-2FFVB1156E

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 328 I/O 1156FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU9EG-2FFVB1156E datasheetXCZU9EG-2FFVB1156E Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Number of I/O: 328
Description

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System On Chip (SoC) is an integrated circuit that incorporates a computational core, memory, and other components required to host an entire system on the single chip. It is typically used to power embedded systems and facilitates the physical integration of components for efficiency. XCZU9EG-2FFVB1156E is one such System On Chip.

XCZU9EG-2FFVB1156E utilizes a FPGA-based architecture and is designed to provide high-performance logic, memory, and digital signal processing capabilities. It is a mid-range device that provides flexibility and enables the development of solutions for a wide range of high-performance applications. The device is available in the Flip-Chip Ball Grid Array (FCBGA) package type and has a maximum operating temperature of 85°C.

XCZU9EG-2FFVB1156E is ideal for embedded applications that require high performance and low power consumption in small form factors. It is used in video and imaging, scientific imaging and high-speed serial communications systems. The primary applications of this device are telecommunications, medical, industrial control, and automotive.

The XCZU9EG-2FFVB1156E device consists of several components including ARM Cortex-A9 processors, hardened easy-to-use peripherals, embedded memory blocks and programmable logic. This makes the device an ideal choice for embedded applications. It is capable of operating at frequencies of up to 538Mhz, providing high-performance with power efficiency. Additionally, it provides features such as an on-chip debug engine and extended temperature ranges.

The working principle of the XCZU9EG-2FFVB1156E is based on the ARM Cortex-A9 processor. This processor is designed to provide enhanced instruction set and integration capabilities. It is a dual-issue pipeline architecture which enables the processor to execute four instructions per cycle. This enables the device to provide high performance with low power consumption. Additionally, the device includes a vector floating point unit which accelerates the performance of multimedia applications.

The FPGA-based architecture of the device supports various technologies such as high-speed transceivers, SERDES, and DDR3 or DDR4 memory. This enables the device to provide a versatile and efficient architecture for high-performance applications. Additionally, the device includes several hard IP subsystems such as GbE MACs, AXI Interconnects, and system performance monitors. The combination of these components ensures that the device is suitable for various embedded applications and provides reliable performance.

In conclusion, the XCZU9EG-2FFVB1156E System On Chip is an ideal choice for embedded applications that require high performance and low power consumption in small form factors. It utilizes a FPGA-based architecture which provides versatility and efficiency. Additionally, the ARM Cortex-A9 processor provides high performance with low power consumption and the device includes several hard IP subsystems to ensure reliable performance. This makes the device suitable for various embedded applications.

The specific data is subject to PDF, and the above content is for reference

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