XCZU17EG-L1FFVC1760I Allicdata Electronics
Allicdata Part #:

XCZU17EG-L1FFVC1760I-ND

Manufacturer Part#:

XCZU17EG-L1FFVC1760I

Price: $ 4.16
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 512 I/O 1760FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU17EG-L1FFVC1760I datasheetXCZU17EG-L1FFVC1760I Datasheet/PDF
Quantity: 1000
1 +: $ 3.78000
Stock 1000Can Ship Immediately
$ 4.16
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of I/O: 512
Description

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XCZU17EG-L1FFVC1760I, classified as Embedded-System On Chip (SoC) can differ from other Embedded-System On Chip products. This XCZU17EG-L1FFVC1760I is especially designed for the applications which require high performance computing for AI, HPC and network acceleration. This multi-core processor developed by Xilinx provides exceptional computing performance, offering up to 24 RISC-V cores with ultra-high memory bandwidth and high-performance FPGA fabrics, with the maximum reduction of TDP.The applications of this XCZU17EG-L1FFVC1760I include many different kinds, like AI Graphics Augmented Reality, Neural Network Processing, Image Recognition, Trainee search, Audio Processing, and more. For the AI Graphics Augmented Reality solution, this SoC not only increases the efficiency and accuracy of the process, but also effectiveness in graphical applications like gaming. Neural Network Processing is powered by large number of high-speed cores and cores used for communication interface, which makes it a high-performance platform. As for Image Recognition, this SoC uses specific architectural optimizations to increase the accuracy and speed of the process. The XCZU17EG-L1FFVC1760I also utilizes efficient matrix processing for the laser navigation solution, trainee search, audio and vision processing. These solutions serve as a reliable platform for such applications.In addition to the applications, the working principle of the XCZU17EG-L1FFVC1760I is quite simple. As an SoC, it is built on a highly integrated chip, which allows the processor to access multiple system components. On a single chip, there are several components such as main processor, memory controller, peripheral I/O, and accelerator blocks. Once the system is booted up, the main processor runs the main application paralleled with other system functions and components. The main processor consists of multiple cores with its own dedicated FPGA fabric, thus providing data accelerations and offload capabilities to the processor. It also has access to cache-coherent memory and peripheral I/O, which enable the SoC for more efficient data handling and communication.To sum up, the XCZU17EG-L1FFVC1760I is an Embedded-System on chip product from Xilinx. This multi-core processor is especially designed for the applications which require high performance computing for AI, HPC and network acceleration. Its applications include AI Graphics Augmented Reality, Neural Network Processing, Image Recognition , Trainee search, Audio Processing, and more. The working principle of the SoC is quite simple, as it consists of multiple components such as main processor, memory controller, peripheral I/O and accelerator blocks. With the help of its main processor which consists of multiple cores with dedicated FPGA fabric, the XCZU17EG-L1FFVC1760I provides high performance and advanced computing capabilities.

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