XL25-40-40-2

Series:	XL-25
Part Status:	Active
Type:	Heat Spreader
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	--
Shape:	Square
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.079" (2.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Ceramic
Material Finish:	--

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Thermal - Heat SinksHeat sinks are a type of cooling device used to disperse the heat from components and other sources of energy, such as in applications of power generation. A thermal heat sink is a heat-dissipating object connected to a surface or enclosure to effectively manage the heat generated by the components of the system. Thermal heat sinks are also commonly used in computers, mobile devices, and other electronic components to keep their operating temperatures in check. The XL25-40-40-2 thermal heat sink is designed for power supplies and other high-power sources of energy. It is suited for a wide range of thermal applications and provides good thermal conduction and heat dissipation abilities.The XL25-40-40-2 thermal heat sink is a compact device that delivers highly efficient heat dissipation. It is composed of metal sheets that have a high thermal conductivity, which enables efficient transfer of heat to the outside of the device. The sheets are connected in a particular geometric shape, which further increases the heat dissipation ability of the heat sink. The XL25-40-40-2 thermal heat sink also includes a variety of fins, such as straight fins, spiral fins, mini fins, and V-fins, to facilitate optimal cooling in tight spaces.The XL25-40-40-2 thermal heat sink is designed to be used in applications where high-power sources and components are present. This includes, but is not limited to, power supplies, solar cells, and electric and hybrid cars. The device can also be used in LED lighting fixtures and semiconductor-based products. The versatile design of the XL25-40-40-2 thermal heat sink makes it suitable for use in a variety of thermal applications.The working principle of the XL25-40-40-2 thermal heat sink is simple and effective. Heat from the components of the system is transferred to the metal sheets on the sink via thermal conduction. The fin geometry of the XL25-40-40-2 enables efficient transfer of the heat to the outside of the device, allowing it to effectively disperse the heat. As the heat dissipates, it gets replaced by cooler air, further improving the efficiency of the heat sink.The XL25-40-40-2 thermal heat sink is designed for ease of installation and superior performance. It is easy to install and requires no special tools for maintenance. The device is lightweight and has minimal impact on the electrical system during installation. In addition, it offers excellent thermal conduction and highly efficient heat dissipation. The XL25-40-40-2 is an ideal solution for a variety of thermal applications, especially where there are high-power sources and components that need to be cooled.

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