XL25-40-40-3 Allicdata Electronics
Allicdata Part #:

1168-1638-ND

Manufacturer Part#:

XL25-40-40-3

Price: $ 0.84
Product Category:

Fans, Thermal Management

Manufacturer: t-Global Technology
Short Description: XL25 CERAMIC BOARD 40X40X3MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Cerami...
DataSheet: XL25-40-40-3 datasheetXL25-40-40-3 Datasheet/PDF
Quantity: 3110
1 +: $ 0.76230
10 +: $ 0.72702
25 +: $ 0.70787
50 +: $ 0.68872
100 +: $ 0.65048
250 +: $ 0.61221
500 +: $ 0.57396
1000 +: $ 0.53569
5000 +: $ 0.51656
Stock 3110Can Ship Immediately
$ 0.84
Specifications
Series: XL-25
Part Status: Active
Type: Heat Spreader
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: --
Shape: Square
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.118" (3.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Ceramic
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

XL25-40-40-3 Application Field and Working Principle

Thermal - Heat Sinks are widely used in various application fields to provide efficient heat dissipation. The XL25-40-40-3 is a high-end heat sink that is specifically designed for circuit boards and other heat-sensitive systems that require accelerated cooling to prevent overheating. This heat sink has a lightweight construction that is suitable for use in space-constrained applications.

Features

The XL25-40-40-3 features a high-end aluminum fin heat sink with an extrusion profile. The aluminum fins are silver-plated for maximum heat transfer that enables effective heat dissipation. This heat sink also features an anodized black oxide finish which provides superior corrosion resistance. The heat sink has a maximum temperature rating of 140°C and can handle up to 25 watts of power.

Design

The XL25-40-40-3 heat sink has an extrusion profile design with two hollow channels running along the outside of the fin. At the end of these channels, warm air is dispersed outward to further dissipate heat. The heat sink also features a large number of aluminum fins which increases its heat dissipation area and provides an efficient cooling solution for any system.

Installation

The XL25-40-40-3 was designed for quick and easy installation, making it ideal for large-scale applications. The heat sink is designed to be mounted directly to the board or heat-sensitive components with two screws. The heat sink also includes a washer to ensure proper seating and prevent any shorting out of the components.

Working Principle

The heat sink uses natural convection to effectively dissipate heat from the circuit board or device. As the heated air rises, it passes through the fins, transferring heat to them and cooling the surrounding air. This airflow is then expelled to the external environment, dissipating the heat into the atmosphere.

The XL25-40-40-3 heat sink also takes advantage of the thermal contact that is created between the component and the heat sink itself. This thermal contact increases the efficiency of heat transfer, ensuring that the system is not affected by overheating.

Conclusion

The XL25-40-40-3 is an ideal thermal solution for heat-sensitive applications. Its lightweight construction and anodized black oxide finish make it well-suited for use in space-constrained systems. The heat sink features an efficient heat dissipation design that uses natural convection and thermal contact to quickly and effectively dissipate heat into the surrounding environment.

The specific data is subject to PDF, and the above content is for reference

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