Allegro half bridge driver - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
568-14587-ND	MM908E625ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	26 Order	--
MM908E625ACPEKR 2-ND	MM908E625ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	1000 Order	1000+: $3.5211
MM908E622ACEK-N D	MM908E622ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E625ACEK-N D	MM908E625ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E621ACPEKR 2-ND	MM908E621ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E621	1000 Order	1000+: $3.5721
MM908E622ACPEKR 2-ND	MM908E622ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	1000+: $4.1419
MM908E622ACPEK- ND	MM908E622ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E625ACDWB- ND	MM908E625ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E622ACDWB- ND	MM908E622ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E621ACDWB- ND	MM908E621ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
CYUSB3065-BZXC- ND	CYUSB3065-BZXC	Cypress Semiconductor Corp	View more Series: EZ-USB CX3 Packaging: Tray Part Status: Active Applications: USB Host/Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 12 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-BGA (10x10)	1320 Order	--
428-4166-ND	CYUSB2014-BZXI	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tray Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	337 Order	--
CYUSB3064-BZXC- ND	CYUSB3064-BZXC	Cypress Semiconductor Corp	View more Series: EZ-USB CX3 Packaging: Tray Part Status: Active Applications: USB Host/Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 12 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-BGA (10x10)	109 Order	1+: $11.3652 10+: $10.332 25+: $9.5571 240+: $8.7822 480+: $8.0073 720+: $7.4907
CYUSB2014-BZXC- ND	CYUSB2014-BZXC	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tray Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	613 Order	1+: $12.474 10+: $11.34 25+: $10.4895 168+: $9.639 336+: $8.7885 504+: $8.2215
CYUSB3064-BZXI- ND	CYUSB3064-BZXI	Cypress Semiconductor Corp	View more Series: EZ-USB CX3 Packaging: Tray Part Status: Active Applications: USB Host/Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 12 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-BGA (10x10)	184 Order	1+: $13.6521 10+: $12.411 25+: $11.4801 240+: $10.5494 480+: $9.6186
CYUSB2014-BZXCT -ND	CYUSB2014-BZXCT	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tape & Reel (TR) Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	1000 Order	1500+: $7.5411
CYUSB2014-BZXIT -ND	CYUSB2014-BZXIT	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tape & Reel (TR) Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	1000 Order	1500+: $8.8452
TLE98442QXXUMA1 TR-ND	TLE98442QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.3688
TLE9861QXA20XUM A1-ND	TLE9861QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (36 kB) RAM Size: 3K x 8 Interface: SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $1.5276
TLE9867QXA20XUM A1-ND	TLE9867QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (64 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $1.75
TLE9869QXA20XUM A1-ND	TLE9869QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (128 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $1.7945
TLE9867QXA40XUM A1-ND	TLE9867QXA40XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (64 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: VQFN-48-31	1000 Order	2500+: $1.8464
TLE9871QXA20XUM A1-ND	TLE9871QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (36 kB) RAM Size: 3K x 8 Interface: SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $1.8983
TLE9877QXA20XUM A1-ND	TLE9877QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (64 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $2.0837
TLE9877QXA40XUM A1-ND	TLE9877QXA40XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (64 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: VQFN-48-31	1000 Order	2500+: $2.1282
TLE9879QXA20XUM A1-ND	TLE9879QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (128 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $2.143
TLE9879QXA40XUM A1TR-ND	TLE9879QXA40XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (128 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: VQFN-48-31	1000 Order	1+: $0
TLE9831QV-ND	TLE9831QV	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 5 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9831QVXUMA1- ND	TLE9831QVXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 5 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9831QVXUMA2- ND	TLE9831QVXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 5 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE98322QVXUMA1 -ND	TLE98322QVXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE98322QVXUMA2 -ND	TLE98322QVXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE98322QVXUMA3 -ND	TLE98322QVXUMA3	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832-2QX-ND	TLE9832-2QX	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE98322QXXUMA1 -ND	TLE98322QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QV-ND	TLE9832QV	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QVXUMA1- ND	TLE9832QVXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QVXUMA2- ND	TLE9832QVXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QVXUMA3- ND	TLE9832QVXUMA3	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QX-ND	TLE9832QX	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0

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