Double amplifier 3mhz - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MC68HC11E1CFN3- ND	MC68HC11E1CFN3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	--
MC68HC11E1CFN2T R-ND	MC68HC11E1CFN2R 2	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	1+: $0
MC68HC11F1CFN3T R-ND	MC68HC11F1CFN3R 2	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MC68HC11	1000 Order	1+: $0
MC68HC11F1CFN3- ND	MC68HC11F1CFN3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MC68HC11	1000 Order	--
MC68HCP11E0FN-N D	MC68HCP11E0FN	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HCP11	1000 Order	1+: $0
MC68HC11A0CFNE3 -ND	MC68HC11A0CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	--
MC68HC11A1CFNE3 -ND	MC68HC11A1CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	--
MC68HC11D0CFNE3 -ND	MC68HC11D0CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Type: ROMless RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: MC68HC11	1000 Order	1+: $0
MC68HC11E1CFNE2 R-ND	MC68HC11E1CFNE2 R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	450+: $8.3656
MC68HC11E0CFNE3 R-ND	MC68HC11E0CFNE3 R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: MC68HC11	1000 Order	450+: $8.4956
MC68HC11E1CFNE3 R-ND	MC68HC11E1CFNE3 R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	450+: $8.768
MCHC11F1CFNE3R- ND	MCHC11F1CFNE3R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC11	1000 Order	250+: $9.2026
MC68HC11E1VFNE3 R-ND	MC68HC11E1VFNE3 R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	1000 Order	450+: $9.2084
MC68HC11E1CFNE2 -ND	MC68HC11E1CFNE2	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	--
MC68HC11E0CFNE3 -ND	MC68HC11E0CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	23+: $10.5783
MC68L11F1CFNE3- ND	MC68L11F1CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MC68L11	1000 Order	18+: $11.9521
MC68HC11E1MFNE3 -ND	MC68HC11E1MFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	23+: $11.9645
MCHC11F1VFNE3-N D	MCHC11F1VFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC11	1000 Order	18+: $12.0862
MC68HC11A1MFNER TR-ND	MC68HC11A1MFNER	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	1+: $0
MC68HC11E1CFNE3 -ND	MC68HC11E1CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	552 Order	1+: $11.8818 10+: $10.9185 100+: $9.2216 500+: $8.2032
MCHC11F1CFNE3-N D	MCHC11F1CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC11	1496 Order	1+: $12.2472 10+: $11.2927 100+: $9.6431 500+: $8.7548
MC68HC908JB8ADW -ND	MC68HC908JB8ADW	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Base Part Number: MC68HC908	1000 Order	1+: $0
MC68HC711E20CFN 3-ND	MC68HC711E20CFN 3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC711	1000 Order	1+: $0
MC68HC908JB8JP- ND	MC68HC908JB8JP	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP Base Part Number: MC68HC908	1000 Order	1+: $0
MC68HC908JB8FB- ND	MC68HC908JB8FB	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10) Base Part Number: MC68HC908	1000 Order	--
MC68HC908JB8JDW -ND	MC68HC908JB8JDW	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC Base Part Number: MC68HC908	1000 Order	1+: $0
MC68HC908JB8JPE -ND	MC68HC908JB8JPE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP Base Part Number: MC68HC908	1000 Order	--
MC908JB8ADWE-ND	MC908JB8ADWE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Base Part Number: MC908JB8	1000 Order	--
MC68HC711D3CFNE 3-ND	MC68HC711D3CFNE 3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59) Base Part Number: MC68HC711	1000 Order	--
MC68HC711E9CFNE 3-ND	MC68HC711E9CFNE 3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC711	1000 Order	--
MC711K4CFUE3-ND	MC711K4CFUE3	NXP USA Inc	View more Series: HC11 Packaging: Tray Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 62 Program Memory Size: 24KB (24K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14) Base Part Number: MC711K4	1000 Order	1+: $0
296-6511-5-ND	MSP430P313IDL	Texas Instruments	View more Series: MSP430x3xx Packaging: Tube Part Status: Obsolete Core Processor: MSP430 Core Size: 16-Bit Speed: 3MHz Connectivity: UART/USART Peripherals: LCD, POR, WDT Number of I/O: 8 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: Slope A/D Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 56-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 56-SSOP Base Part Number: MSP430P313	1000 Order	1+: $0
MC908JB8JDWE-ND	MC908JB8JDWE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC Base Part Number: MC908JB8	1303 Order	1+: $3.1059 10+: $2.789 100+: $2.285 500+: $1.9452 1000+: $1.6405
MC908JB8FBE-ND	MC908JB8FBE	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: 0C ~ 70C (TA) Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10) Base Part Number: MC908JB8	834 Order	1+: $3.6036 10+: $3.2388 100+: $2.6536 500+: $2.2589 1000+: $1.9051
MC68HC711E9CFN3 -ND	MC68HC711E9CFN3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Interface: SCI, SPI Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Voltage - Supply: 4.5V ~ 5.5V Program Memory Type: OTP EEPROM Size: 512 x 8 Mounting Type: Surface Mount RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC711	1000 Order	--
MCHC711KS2CFNE3 -ND	MCHC711KS2CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC711	1000 Order	1+: $0
MCHC711KS2VFNE3 -ND	MCHC711KS2VFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Obsolete Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC711	1000 Order	1+: $0
MC68711E20CFNE3 -ND	MC68711E20CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68711	1000 Order	--

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