Embedded engine control - Allicdata Electronics

Related Categories

1 2 3 4 5 >

Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MEC1701Q-C2-SZ- ND	MEC1701Q-C2-SZ	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	518 Order	1+: $2.8224 25+: $2.3491 100+: $2.2712
MEC1705Q-C2-I/S Z-ND	MEC1705Q-C2-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: EEPROM (2 kB), Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	520 Order	1+: $3.4965 25+: $2.9136 100+: $2.8146
MEC1701H-C1-SZ- ND	MEC1701H-C1-SZ	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 256KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
MEC1322-LZY-C0- ND	MEC1322-LZY-C0	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 RAM Size: 128KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, UART Number of I/O: 116 Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 132-VFQFN Dual Rows, Exposed Pad Supplier Device Package: 132-DQFN (11x11)	336 Order	--
MEC1701H-C1-SZ- TR-ND	MEC1701H-C1-SZ- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 256KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
MEC1704Q-C2-I/S Z-ND	MEC1704Q-C2-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	520 Order	1+: $3.1563 25+: $2.6281 100+: $2.5388
MEC1705Q-C1-I/S Z-ND	MEC1705Q-C1-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: EEPROM (2 kB), Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
MEC1704Q-C1-I/S Z-ND	MEC1704Q-C1-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
1613-1031-ND	PICASO	4D Systems Pty Ltd	View more Packaging: Tray Part Status: Active Applications: Graphics Processor Core Processor: EVE Program Memory Type: FLASH (14 kB) RAM Size: 14K x 8 Interface: IC, LCD, OLED, SD/SDHC, SPI, TFT, TTL, UART Number of I/O: 13 Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40C ~ 80C Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10x10)	190 Order	1+: $9.6075 10+: $8.6461 50+: $8.41
MEC1322-LZY-C0- TR-ND	MEC1322-LZY-C0- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 RAM Size: 128KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, UART Number of I/O: 116 Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 132-VFQFN Dual Rows, Exposed Pad Supplier Device Package: 132-DQFN (11x11)	1000 Order	2500+: $2.4172
CEC1702Q-B1-SX- TR-ND	CEC1702Q-B1-SX- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Cryptography Core Processor: ARM Cortex-M4F Program Memory Type: SRAM RAM Size: 480K x 8 Interface: IC, SPI, UART Number of I/O: 65 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	1000 Order	1+: $0
CEC1702Q-C1-SX- TR-ND	CEC1702Q-C1-SX- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Cryptography Core Processor: ARM Cortex-M4F Program Memory Type: SRAM RAM Size: 480K x 8 Interface: IC, SPI, UART Number of I/O: 65 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	1000 Order	1+: $0
CEC1702Q-B1-SX- ND	CEC1702Q-B1-SX	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Cryptography Core Processor: ARM Cortex-M4F Program Memory Type: SRAM RAM Size: 480K x 8 Interface: IC, SPI, UART Number of I/O: 65 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	1000 Order	1+: $0
CEC1702Q-C2-I/S X-ND	CEC1702Q-C2-I/S X	Microchip Technology	View more Series: * Packaging: Tray Part Status: Active Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	520 Order	1+: $3.0681 25+: $2.5568 100+: $2.474
CEC1702Q-B2-I/S X-ND	CEC1702Q-B2-I/S X	Microchip Technology	View more Series: * Packaging: Tray Part Status: Active Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	370 Order	1+: $3.0681 25+: $2.5568 100+: $2.474
MEC1310-PZV-ND	MEC1310-PZV	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: 8051 RAM Size: 64KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 56 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 144-TFBGA Supplier Device Package: 144-TFBGA (7x7) Base Part Number: MEC1310	1000 Order	416+: $2.2306
MEC1310-NU-ND	MEC1310-NU	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: 8051 RAM Size: 64KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 56 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 128-TQFP Supplier Device Package: 128-VTQFP (14x14) Base Part Number: MEC1310	1000 Order	270+: $1.9873
MEC1310-NU-TR-N D	MEC1310-NU-TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: I/O Controller Core Processor: 8051 RAM Size: 64KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 56 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 128-TQFP Supplier Device Package: 128-VTQFP (14x14) Base Part Number: MEC1310	1000 Order	--
MEC1633X-AUE-ND	MEC1633X-AUE	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 135 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-LFBGA (11x11) Base Part Number: MEC1633	1000 Order	176+: $3.6501
MEC1609-PZV-ND	MEC1609-PZV	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, VLPC Number of I/O: 115 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-TFBGA Supplier Device Package: 144-TFBGA (7x7) Base Part Number: MEC1609	1000 Order	240+: $3.0417
MEC1609-PZP-ND	MEC1609-PZP	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, VLPC Number of I/O: 115 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-LFBGA Supplier Device Package: 144-LFBGA (10x10) Base Part Number: MEC1609	240 Order	1+: $3.5469 25+: $2.959 100+: $2.8552
TLE9834QXXUMA2- ND	TLE9834QXXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (64 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
MEC1609I-PZP-ND	MEC1609I-PZP	Microchip Technology	View more Packaging: Tube Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, VLPC Number of I/O: 115 Voltage - Supply: 3.3V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-LFBGA Supplier Device Package: 144-LFBGA (10x10) Base Part Number: MEC1609	1000 Order	240+: $3.569
TLE9845QXXUMA1T R-ND	TLE9845QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (48 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.2898
TLE9844QXXUMA1T R-ND	TLE9844QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.3292
TLE98432QXXUMA1 TR-ND	TLE98432QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (52 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.2898
TLE9842QXXUMA1T R-ND	TLE9842QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (36 kB) RAM Size: 2K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.1839
TLE9843QXXUMA1T R-ND	TLE9843QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (48 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: VQFN-48-31	2500 Order	2500+: $1.2422
TLE98422QXXUMA1 TR-ND	TLE98422QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (40 kB) RAM Size: 2K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.2317
MM912KS812AMAF- ND	MM912KS812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	78 Order	1+: $6.4953 10+: $5.8691 100+: $4.8589 500+: $4.2311 1000+: $3.6851
MM912KS812AMAFR 2-ND	MM912KS812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	1000 Order	1000+: $3.6851
MM912JS812AMAF- ND	MM912JS812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JS812	1000 Order	--
MM912JP812AMAFR 2-ND	MM912JP812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JP812	1000 Order	800+: $2.5682
MM912IP812AMAFR 2-ND	MM912IP812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912IP812	1000 Order	800+: $2.4803
MM912JP812AMAF- ND	MM912JP812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JP812	1000 Order	90+: $3.3967
MM912JS812AMAFR 2-ND	MM912JS812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JS812	1000 Order	800+: $2.8612
MM912IP812AMAF- ND	MM912IP812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912IP812	1000 Order	450+: $2.7203
1488-1115-ND	PAC5523QM	Active-Semi International Inc.	View more Packaging: Tray Part Status: Active Applications: Motor Control Core Processor: ARM Cortex-M4F Program Memory Type: FLASH (128 kB) RAM Size: 32K x 8 Interface: CAN, IC, SPI, UART/USART Number of I/O: 15 Voltage - Supply: 5 V ~ 20 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 48-WFQFN Exposed Pad Supplier Device Package: 48-TQFN-EP (6x6)	490 Order	--
428-3181-ND	CYUSB3013-BZXC	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tray Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 60 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10) Base Part Number: CYUSB3013	765 Order	--
CYUSB3065-BZXI- ND	CYUSB3065-BZXI	Cypress Semiconductor Corp	View more Series: EZ-USB CX3 Packaging: Tray Part Status: Active Applications: USB Host/Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 12 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-BGA (10x10) Base Part Number: CYUSB3065	2304 Order	--

1 2 3 4 5 >

Hot Searches: embedded engine control embedded controller embedded car controller embedded dc controller embedded communication controller desktop embedded controller embedded input controller embedded output controller embedded inductance controller embedded sensor controller embedded interface controller embedded industrial controller embedded infrared controller embedded lin controller embedded remote control embedded peripheral controller embedded hub controller embedded serial controller embedded power controller embedded ultra-high-speed controller

Search Result:embedded engine control

Related Categories