Embedded lin controller - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MEC1701Q-C2-SZ- ND	MEC1701Q-C2-SZ	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	518 Order	1+: $2.8224 25+: $2.3491 100+: $2.2712
MEC1705Q-C2-I/S Z-ND	MEC1705Q-C2-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: EEPROM (2 kB), Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	520 Order	1+: $3.4965 25+: $2.9136 100+: $2.8146
MEC1701H-C1-SZ- ND	MEC1701H-C1-SZ	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 256KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
MEC1322-LZY-C0- ND	MEC1322-LZY-C0	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 RAM Size: 128KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, UART Number of I/O: 116 Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 132-VFQFN Dual Rows, Exposed Pad Supplier Device Package: 132-DQFN (11x11)	336 Order	--
MEC1701H-C1-SZ- TR-ND	MEC1701H-C1-SZ- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 256KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
MEC1704Q-C2-I/S Z-ND	MEC1704Q-C2-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	520 Order	1+: $3.1563 25+: $2.6281 100+: $2.5388
MEC1705Q-C1-I/S Z-ND	MEC1705Q-C1-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: EEPROM (2 kB), Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
MEC1704Q-C1-I/S Z-ND	MEC1704Q-C1-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	1000 Order	1+: $0
TLE9834QXXUMA2- ND	TLE9834QXXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (64 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
TLE9845QXXUMA1T R-ND	TLE9845QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (48 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.2898
TLE9844QXXUMA1T R-ND	TLE9844QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.3292
TLE98432QXXUMA1 TR-ND	TLE98432QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (52 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.2898
TLE9842QXXUMA1T R-ND	TLE9842QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (36 kB) RAM Size: 2K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.1839
TLE9843QXXUMA1T R-ND	TLE9843QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (48 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: VQFN-48-31	2500 Order	2500+: $1.2422
TLE98422QXXUMA1 TR-ND	TLE98422QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (40 kB) RAM Size: 2K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.2317
1613-1031-ND	PICASO	4D Systems Pty Ltd	View more Packaging: Tray Part Status: Active Applications: Graphics Processor Core Processor: EVE Program Memory Type: FLASH (14 kB) RAM Size: 14K x 8 Interface: IC, LCD, OLED, SD/SDHC, SPI, TFT, TTL, UART Number of I/O: 13 Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40C ~ 80C Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10x10)	190 Order	1+: $9.6075 10+: $8.6461 50+: $8.41
MEC1322-LZY-C0- TR-ND	MEC1322-LZY-C0- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 RAM Size: 128KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, UART Number of I/O: 116 Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 132-VFQFN Dual Rows, Exposed Pad Supplier Device Package: 132-DQFN (11x11)	1000 Order	2500+: $2.4172
CEC1702Q-B1-SX- TR-ND	CEC1702Q-B1-SX- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Cryptography Core Processor: ARM Cortex-M4F Program Memory Type: SRAM RAM Size: 480K x 8 Interface: IC, SPI, UART Number of I/O: 65 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	1000 Order	1+: $0
CEC1702Q-C1-SX- TR-ND	CEC1702Q-C1-SX- TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Cryptography Core Processor: ARM Cortex-M4F Program Memory Type: SRAM RAM Size: 480K x 8 Interface: IC, SPI, UART Number of I/O: 65 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	1000 Order	1+: $0
CEC1702Q-B1-SX- ND	CEC1702Q-B1-SX	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Cryptography Core Processor: ARM Cortex-M4F Program Memory Type: SRAM RAM Size: 480K x 8 Interface: IC, SPI, UART Number of I/O: 65 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	1000 Order	1+: $0
568-14088-ND	MM912J637AM2EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912J637	1300 Order	--
MM912I637AM2EPR 2-ND	MM912I637AM2EPR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912I637	1000 Order	2000+: $3.1397
MM912I637AV1EPR 2-ND	MM912I637AV1EPR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912I637	1000 Order	2000+: $3.072
MM912J637AV1EPR 2-ND	MM912J637AV1EPR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912J637	1000 Order	2000+: $3.3343
568-14332-ND	MM912I637AV1EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912I637	260 Order	1+: $5.4999 10+: $4.9663 100+: $4.1114 500+: $3.5801 1000+: $3.1182
568-14327-ND	MM912I637AM2EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912I637	1000 Order	1+: $5.6196 10+: $5.0753 100+: $4.202 500+: $3.659 1000+: $3.1869
MM912J637AV1EP- ND	MM912J637AV1EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912J637	1000 Order	1300+: $3.3845
MM912J637AM2EPR 2-ND	MM912J637AM2EPR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912J637	1000 Order	2000+: $3.402
CEC1702Q-C2-I/S X-ND	CEC1702Q-C2-I/S X	Microchip Technology	View more Series: * Packaging: Tray Part Status: Active Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	520 Order	1+: $3.0681 25+: $2.5568 100+: $2.474
CEC1702Q-B2-I/S X-ND	CEC1702Q-B2-I/S X	Microchip Technology	View more Series: * Packaging: Tray Part Status: Active Mounting Type: Surface Mount Package / Case: 84-WFBGA Supplier Device Package: 84-WFBGA (7x7)	370 Order	1+: $3.0681 25+: $2.5568 100+: $2.474
MEC1310-PZV-ND	MEC1310-PZV	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: 8051 RAM Size: 64KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 56 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 144-TFBGA Supplier Device Package: 144-TFBGA (7x7) Base Part Number: MEC1310	1000 Order	416+: $2.2306
MEC1310-NU-ND	MEC1310-NU	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: 8051 RAM Size: 64KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 56 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 128-TQFP Supplier Device Package: 128-VTQFP (14x14) Base Part Number: MEC1310	1000 Order	270+: $1.9873
MEC1310-NU-TR-N D	MEC1310-NU-TR	Microchip Technology	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: I/O Controller Core Processor: 8051 RAM Size: 64KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 56 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 128-TQFP Supplier Device Package: 128-VTQFP (14x14) Base Part Number: MEC1310	1000 Order	--
MEC1633X-AUE-ND	MEC1633X-AUE	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI Number of I/O: 135 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-LFBGA (11x11) Base Part Number: MEC1633	1000 Order	176+: $3.6501
MEC1609-PZV-ND	MEC1609-PZV	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, VLPC Number of I/O: 115 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-TFBGA Supplier Device Package: 144-TFBGA (7x7) Base Part Number: MEC1609	1000 Order	240+: $3.0417
MEC1609-PZP-ND	MEC1609-PZP	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, VLPC Number of I/O: 115 Voltage - Supply: 3.3V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-LFBGA Supplier Device Package: 144-LFBGA (10x10) Base Part Number: MEC1609	240 Order	1+: $3.5469 25+: $2.959 100+: $2.8552
MEC1609I-PZP-ND	MEC1609I-PZP	Microchip Technology	View more Packaging: Tube Part Status: Active Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) RAM Size: 16KB Interface: ACPI, BC-Link, IC/SMBus, LPC, PECI, PS/2, SPI, VLPC Number of I/O: 115 Voltage - Supply: 3.3V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-LFBGA Supplier Device Package: 144-LFBGA (10x10) Base Part Number: MEC1609	1000 Order	240+: $3.569
MM912F634DV2AE- ND	MM912F634DV2AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
TLE9832QXXUMA1- ND	TLE9832QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
MM912G634CM1AER 2-ND	MM912G634CM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0

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