Half-bridge motor controller - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MM908E625ACPEKR 2-ND	MM908E625ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	1000 Order	1000+: $3.5211
568-14587-ND	MM908E625ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	26 Order	--
MM908E625ACEK-N D	MM908E625ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E622ACEK-N D	MM908E622ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
1488-1115-ND	PAC5523QM	Active-Semi International Inc.	View more Packaging: Tray Part Status: Active Applications: Motor Control Core Processor: ARM Cortex-M4F Program Memory Type: FLASH (128 kB) RAM Size: 32K x 8 Interface: CAN, IC, SPI, UART/USART Number of I/O: 15 Voltage - Supply: 5 V ~ 20 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 48-WFQFN Exposed Pad Supplier Device Package: 48-TQFN-EP (6x6)	490 Order	--
MM908E622ACPEKR 2-ND	MM908E622ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	1000+: $4.1419
MM908E625ACDWB- ND	MM908E625ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E625	1000 Order	--
MM908E622ACPEK- ND	MM908E622ACPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E621ACPEKR 2-ND	MM908E621ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E621	1000 Order	1000+: $3.5721
MM908E622ACDWB- ND	MM908E622ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E621ACDWB- ND	MM908E621ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
MM908E626AVPEKR 2-ND	MM908E626AVPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E626	1000 Order	1000+: $3.5636
MM908E626AVPEK- ND	MM908E626AVPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC Base Part Number: MM908E626	1000 Order	--
MEC1701Q-C2-SZ- ND	MEC1701Q-C2-SZ	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	518 Order	1+: $2.8224 25+: $2.3491 100+: $2.2712
MEC1705Q-C2-I/S Z-ND	MEC1705Q-C2-I/S Z	Microchip Technology	View more Packaging: Tray Part Status: Active Applications: Keyboard and Embedded Controller Core Processor: ARM Cortex-M4 Program Memory Type: EEPROM (2 kB), Boot ROM (64 kB) Controller Series: MEC170x RAM Size: 480KB Interface: ACPI, EBI/EMI, eSPI, IC, LPC, PECI, PS/2, QSPI, SPI Number of I/O: 123 Voltage - Supply: 1.71 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-WFBGA Supplier Device Package: 144-WFBGA (9x9)	520 Order	1+: $3.4965 25+: $2.9136 100+: $2.8146
428-4166-ND	CYUSB2014-BZXI	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tray Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	337 Order	--
CYUSB2014-BZXC- ND	CYUSB2014-BZXC	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tray Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	613 Order	1+: $12.474 10+: $11.34 25+: $10.4895 168+: $9.639 336+: $8.7885 504+: $8.2215
CYUSB3064-BZXI- ND	CYUSB3064-BZXI	Cypress Semiconductor Corp	View more Series: EZ-USB CX3 Packaging: Tray Part Status: Active Applications: USB Host/Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 12 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-BGA (10x10)	184 Order	1+: $13.6521 10+: $12.411 25+: $11.4801 240+: $10.5494 480+: $9.6186
CYUSB3064-BZXC- ND	CYUSB3064-BZXC	Cypress Semiconductor Corp	View more Series: EZ-USB CX3 Packaging: Tray Part Status: Active Applications: USB Host/Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 12 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-BGA (10x10)	109 Order	1+: $11.3652 10+: $10.332 25+: $9.5571 240+: $8.7822 480+: $8.0073 720+: $7.4907
CYUSB3065-BZXC- ND	CYUSB3065-BZXC	Cypress Semiconductor Corp	View more Series: EZ-USB CX3 Packaging: Tray Part Status: Active Applications: USB Host/Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: GPIF, IC, IS, SPI, UART, USB Number of I/O: 12 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-BGA (10x10)	1320 Order	--
CYUSB2014-BZXCT -ND	CYUSB2014-BZXCT	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tape & Reel (TR) Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	1000 Order	1500+: $7.5411
CYUSB2014-BZXIT -ND	CYUSB2014-BZXIT	Cypress Semiconductor Corp	View more Series: EZ-USB FX3 Packaging: Tape & Reel (TR) Part Status: Active Applications: SuperSpeed USB Peripheral Controller Core Processor: ARM9 Program Memory Type: External Program Memory Controller Series: CYUSB RAM Size: 512K x 8 Interface: IC, IS, MMC/SD, SPI, UART, USB Number of I/O: 59 Voltage - Supply: 1.15 V ~ 1.25 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-FBGA (10x10)	1000 Order	1500+: $8.8452
MM908E626AVDWB- ND	MM908E626AVDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E626	1000 Order	--
MM908E626AVEK-N D	MM908E626AVEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E626	1000 Order	--
TLE9832QXXUMA1- ND	TLE9832QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QVXUMA2- ND	TLE9832QVXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832-2QX-ND	TLE9832-2QX	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QV-ND	TLE9832QV	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE98322QXXUMA1 -ND	TLE98322QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9833QXXUMA2- ND	TLE9833QXXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (48 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
TLE98322QVXUMA3 -ND	TLE98322QVXUMA3	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9835QX-ND	TLE9835QX	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (64 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
TLE9833QXXUMA1- ND	TLE9833QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (48 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad	1000 Order	1+: $0
TLE9835QXXUMA1- ND	TLE9835QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (64 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
TLE9831QV-ND	TLE9831QV	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 5 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9832QX-ND	TLE9832QX	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9831QVXUMA1- ND	TLE9831QVXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 5 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9834QXXUMA1- ND	TLE9834QXXUMA1	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (64 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	1+: $0
TLE9832QXXUMA2- ND	TLE9832QXXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 11 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0
TLE9831QVXUMA2- ND	TLE9831QVXUMA2	Infineon Technologies	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: XC800 Program Memory Type: FLASH (36 kB) RAM Size: 3.25K x 8 Interface: LIN, SSI, UART Number of I/O: 5 Voltage - Supply: 3 V ~ 27 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	1000 Order	1+: $0

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