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 --1148 Item(s) In Category:Embedded - Microcontrollers - Application Specific

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Photo Allicdata Part# Mft.Part# Company Spec. QTY. Pricing(USD) PDF
MM912I637AV1EP 568-14332-ND MM912I637AV1EP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (96 KB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912I637
260
Order

1+:

$5.4999

10+:

$4.9663

100+:

$4.1114

500+:

$3.5801

1000+:

$3.1182

 568-14332-ND Datasheet
MM912J637AM2EP 568-14088-ND MM912J637AM2EP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912J637
1300
Order

--

 568-14088-ND Datasheet
MM912I637AM2EPR2 MM912I637AM2EPR
2-ND		 MM912I637AM2EPR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (96 KB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912I637
1000
Order

2000+:

$3.1397

 MM912I637AM2EPR2-ND Datasheet
MM912J637AV1EPR2 MM912J637AV1EPR
2-ND		 MM912J637AV1EPR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912J637
1000
Order

2000+:

$3.3343

 MM912J637AV1EPR2-ND Datasheet
MM912I637AV1EPR2 MM912I637AV1EPR
2-ND		 MM912I637AV1EPR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (96 KB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912I637
1000
Order

2000+:

$3.072

 MM912I637AV1EPR2-ND Datasheet
MM912J637AV1EP MM912J637AV1EP-
ND		 MM912J637AV1EP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912J637
1000
Order

1300+:

$3.3845

 MM912J637AV1EP-ND Datasheet
MM912J637AM2EPR2 MM912J637AM2EPR
2-ND		 MM912J637AM2EPR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (128 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912J637
1000
Order

2000+:

$3.402

 MM912J637AM2EPR2-ND Datasheet
MM912I637AM2EP 568-14327-ND MM912I637AM2EP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Battery Monitor
 Core Processor: S12
 Program Memory Type: FLASH (96 KB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI, SPI
 Number of I/O: 8
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: 48-QFN-EP (7x7)
 Base Part Number: MM912I637
1000
Order

1+:

$5.6196

10+:

$5.0753

100+:

$4.202

500+:

$3.659

1000+:

$3.1869

 568-14327-ND Datasheet
MM912G634DV1AE 568-14487-ND MM912G634DV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
250
Order

--

 568-14487-ND Datasheet
MM912F634DV2AE MM912F634DV2AE-
ND		 MM912F634DV2AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634DV2AE-ND Datasheet
TLE9832QXXUMA1 TLE9832QXXUMA1-
ND		 TLE9832QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QXXUMA1-ND Datasheet
MM912G634CM1AER2 MM912G634CM1AER
2-ND		 MM912G634CM1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.25 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

1+:

$0

 MM912G634CM1AER2-ND Datasheet
TLE98322QVXUMA3 TLE98322QVXUMA3
-ND		 TLE98322QVXUMA3 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE98322QVXUMA3-ND Datasheet
TLE9835QX TLE9835QX-ND TLE9835QX Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (64 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9835QX-ND Datasheet
TLE9831QVXUMA1 TLE9831QVXUMA1-
ND		 TLE9831QVXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 5
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9831QVXUMA1-ND Datasheet
MM912G634DC1AE MM912G634DC1AE-
ND		 MM912G634DC1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

250+:

$4.3268

 MM912G634DC1AE-ND Datasheet
TLE9832-2QX TLE9832-2QX-ND TLE9832-2QX Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832-2QX-ND Datasheet
TLE9832QVXUMA3 TLE9832QVXUMA3-
ND		 TLE9832QVXUMA3 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QVXUMA3-ND Datasheet
MM912G634CV2APR2 MM912G634CV2APR
2-ND		 MM912G634CV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.25 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

1+:

$0

 MM912G634CV2APR2-ND Datasheet
ISD9160FI ISD9160FI-ND ISD9160FI Nuvoton Technology Corporation of America
View more  Packaging: Tray
 Part Status: Active
 Applications: Audio Record/Playback
 Core Processor: ARM Cortex-M0
 Program Memory Type: FLASH (145 kB)
 RAM Size: 12K x 8
 Interface: IC, IrDA, LIN, SPI, UART/USART
 Number of I/O: 8
 Voltage - Supply: 2.5 V ~ 5.5 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
1000
Order

490+:

$1.3537

 ISD9160FI-ND Datasheet
TLE9834QXXUMA1 TLE9834QXXUMA1-
ND		 TLE9834QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (64 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9834QXXUMA1-ND Datasheet
MM912G634CV2AP MM912G634CV2AP-
ND		 MM912G634CV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.25 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

1+:

$0

 MM912G634CV2AP-ND Datasheet
ISD9160VFI ISD9160VFI-ND ISD9160VFI Nuvoton Technology Corporation of America
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Audio Record/Playback
 Core Processor: ARM Cortex-M0
 Program Memory Type: FLASH (145 kB)
 RAM Size: 12K x 8
 Interface: IC, IrDA, LIN, SPI, UART/USART
 Number of I/O: 8
 Voltage - Supply: 2.5 V ~ 5.5 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
1000
Order

1+:

$0

 ISD9160VFI-ND Datasheet
TLE98322QVXUMA1 TLE98322QVXUMA1
-ND		 TLE98322QVXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE98322QVXUMA1-ND Datasheet
TLE9832QVXUMA1 TLE9832QVXUMA1-
ND		 TLE9832QVXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QVXUMA1-ND Datasheet
TLE9831QV TLE9831QV-ND TLE9831QV Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 5
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9831QV-ND Datasheet
MM912G634DV2AP MM912G634DV2AP-
ND		 MM912G634DV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

--

 MM912G634DV2AP-ND Datasheet
TLE9832QX TLE9832QX-ND TLE9832QX Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QX-ND Datasheet
MM912G634DC2APR2 MM912G634DC2APR
2-ND		 MM912G634DC2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

2000+:

$3.1505

 MM912G634DC2APR2-ND Datasheet
TLE9833QXXUMA1 TLE9833QXXUMA1-
ND		 TLE9833QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (48 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
1000
Order

1+:

$0

 TLE9833QXXUMA1-ND Datasheet
TLE9832QXXUMA2 TLE9832QXXUMA2-
ND		 TLE9832QXXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QXXUMA2-ND Datasheet
TLE9835QXXUMA1 TLE9835QXXUMA1-
ND		 TLE9835QXXUMA1 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (64 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9835QXXUMA1-ND Datasheet
TLE9833QXXUMA2 TLE9833QXXUMA2-
ND		 TLE9833QXXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (48 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9833QXXUMA2-ND Datasheet
MM912H634DV1AE 568-14486-ND MM912H634DV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
250
Order

--

 568-14486-ND Datasheet
MM912F634DV2APR2 MM912F634DV2APR
2-ND		 MM912F634DV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912F634
1000
Order

2000+:

$1.8937

 MM912F634DV2APR2-ND Datasheet
TLE9832QXXUMA3 TLE9832QXXUMA3-
ND		 TLE9832QXXUMA3 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (36 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-31
1000
Order

1+:

$0

 TLE9832QXXUMA3-ND Datasheet
MM912F634CV2APR2 MM912F634CV2APR
2-ND		 MM912F634CV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634CV2APR2-ND Datasheet
MM912F634CV2AP MM912F634CV2AP-
ND		 MM912F634CV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634CV2AP-ND Datasheet
MM912G634DM1AE MM912G634DM1AE-
ND		 MM912G634DM1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

250+:

$5.0016

 MM912G634DM1AE-ND Datasheet
MM912F634CV2AE MM912F634CV2AE-
ND		 MM912F634CV2AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634CV2AE-ND Datasheet
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