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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MCF5475ZP200-ND	MCF5475ZP200	NXP USA Inc	View more Series: MCF547x Packaging: Tray Part Status: Obsolete Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 200MHz Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27) Base Part Number: MCF5475	1000 Order	1+: $0
MPC860SRCVR50D4 -ND	MPC860SRCVR50D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Not For New Designs Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	44+: $51.4504
KMPC860DPVR80D4 -ND	KMPC860DPVR80D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
568-1237-5-ND	P80C552EFA/08,5 12	NXP USA Inc	View more Series: 80C Packaging: Tube Part Status: Obsolete Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, IC, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 40 Program Memory Type: ROMless RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23) Base Part Number: P80C552	1000 Order	1+: $0
XPC850DSLCVR50B U-ND	XPC850DSLCVR50B U	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
MPC860DTZQ66D4- ND	MPC860DTZQ66D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
MPC862PZQ50B-ND	MPC862PZQ50B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC862	1000 Order	1+: $0
MCF54450CVM180- ND	MCF54450CVM180	NXP USA Inc	View more Series: MCF5445x Packaging: Tray Part Status: Active Core Processor: Coldfire V4 Core Size: 32-Bit Speed: 180MHz Connectivity: IC, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA Base Part Number: MCF54450	1000 Order	450+: $9.0815
568-1832-2-ND	PCA9534BS,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 8 Interface: IC, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 16-VQFN Exposed Pad Supplier Device Package: 16-HVQFN (4x4) Base Part Number: PCA9534	1000 Order	6000+: $0.3961
PCA9556PW,118-N D	PCA9556PW,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Number of I/O: 8 Interface: IC, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 20mA Clock Frequency: 100kHz Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP Base Part Number: PCA9556	1000 Order	1+: $0
MPC862PZQ100B-N D	MPC862PZQ100B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC862	1000 Order	1+: $0
568-9914-2-ND	PCA9538ABSHP	NXP USA Inc	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 8 Interface: IC, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-HVQFN (3x3) Base Part Number: PCA9538	30000 Order	6000+: $0.358
XPC850SRCVR66BU -ND	XPC850SRCVR66BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
KMPC855TCZQ66D4 -ND	KMPC855TCZQ66D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC855	1000 Order	1+: $0
568-9952-2-ND	PCAL9555AHF,128	NXP USA Inc	View more Series: Agile Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 16 Interface: IC Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 24-WFQFN Exposed Pad Supplier Device Package: 24-HWQFN (4x4) Base Part Number: PCAL9555A	6000 Order	6000+: $0.4776
MC9328MX21CJM-N D	MC9328MX21CJM	NXP USA Inc	View more Series: i.MX21 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD USB: USB 1.x (2) Voltage - I/O: 1.8V, 3.0V Operating Temperature: -40C ~ 85C (TA) Package / Case: 289-LFBGA Additional Interfaces: 1-Wire, IC, IS, SPI, SSI, MMC/SD, UART Base Part Number: MC9328MX21	1000 Order	450+: $13.9583
MPC859PZP133A-N D	MPC859PZP133A	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC859	1000 Order	1+: $0
XPC850CZT66BU-N D	XPC850CZT66BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
MCIMX233DAG4B-N D	MCIMX233DAG4B	NXP USA Inc	View more Series: i.MX23 Packaging: Tray Part Status: Obsolete Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen USB: USB 2.0 + PHY (1) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10C ~ 70C (TA) Security Features: Cryptography, Hardware ID Package / Case: 128-LQFP Additional Interfaces: IC, IS, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Base Part Number: MCIMX233	1000 Order	--
KMPC860TCVR50D4 -ND	KMPC860TCVR50D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
XPC850DEZT66BU- ND	XPC850DEZT66BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
KMPC850DEZQ80BU -ND	KMPC850DEZQ80BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: MPC850	1000 Order	1+: $0
MCF5253CVM140-N D	MCF5253CVM140	NXP USA Inc	View more Series: MCF525x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 140MHz Connectivity: CANbus, EBI/EMI, IC, QSPI, UART/USART, USB OTG Peripherals: DMA, WDT Program Memory Type: ROMless RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 1.32 V Data Converters: A/D 6x12b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13) Base Part Number: MCF5253	1000 Order	--
P80C557E4EFB/01 ,55-ND	P80C557E4EFB/01 ,55	NXP USA Inc	View more Series: 80C Packaging: Tray Part Status: Obsolete Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, IC, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 40 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14x20) Base Part Number: P80C557	1000 Order	1+: $0
MPC862TCVR66B-N D	MPC862TCVR66B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 115C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC862	1000 Order	1+: $0
MCF5471VR200-ND	MCF5471VR200	NXP USA Inc	View more Series: MCF547x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 200MHz Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27) Base Part Number: MCF5471	1000 Order	--
MPC5123YVY400B- ND	MPC5123YVY400B	NXP USA Inc	View more Series: MPC5123 Packaging: Tray Part Status: Not For New Designs Core Processor: e300 Core Size: 32-Bit Speed: 400MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, USB OTG Peripherals: DMA, WDT Number of I/O: 147 Program Memory Type: ROMless RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27) Base Part Number: MPC5123	1000 Order	--
SA58635UK,027-N D	SA58635UK,027	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Class G Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 25mW x 2 @ 32 Ohm Voltage - Supply: 2.3 V ~ 5.5 V Features: Depop, IC, Short-Circuit and Thermal Protection, Shutdown, Volume Control Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 16-WLCSP (1.7x1.7) Package / Case: 16-UFBGA, WLCSP Base Part Number: SA58635	1000 Order	1+: $0
568-9945-2-ND	PCAL6416AEVJ	NXP USA Inc	View more Series: Agile Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 16 Interface: IC, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 24-VFBGA Supplier Device Package: 24-VFBGA (3x3) Base Part Number: PCAL6416A	6000 Order	6000+: $0.3385
568-8702-2-ND	PCA8575DB,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 16 Interface: IC Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100A, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP Base Part Number: PCA8575	1000 Order	1000+: $0.5646 2000+: $0.5257 5000+: $0.5179
MPC860DTCZQ50D4 -ND	MPC860DTCZQ50D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Not For New Designs Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	44+: $44.8764
KMPC860ENCZQ66D 4-ND	KMPC860ENCZQ66D 4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
MPC855TZQ50D4-N D	MPC855TZQ50D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Not For New Designs Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC855	1000 Order	--
MPC857TCVR80B-N D	MPC857TCVR80B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 115C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC857	1000 Order	1+: $0
KXPC823ZT81B2T- ND	KXPC823ZT81B2T	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 81MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: IC, SMC, SCC, SPI, UART Base Part Number: PC823	1000 Order	1+: $0
MCF5270CVM150-N D	MCF5270CVM150	NXP USA Inc	View more Series: MCF527x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 97 Program Memory Type: ROMless RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15) Base Part Number: MCF5270	1000 Order	--
568-3986-5-ND	PCA9555PW,112	NXP USA Inc	View more Packaging: Tube Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 16 Interface: IC, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP Base Part Number: PCA9555	10606 Order	1+: $1.0395 10+: $0.9349 100+: $0.7515 500+: $0.6174 1000+: $0.5116
PCA9557D,118-ND	PCA9557D,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Number of I/O: 8 Interface: IC, SMBus Interrupt Output: No Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Base Part Number: PCA9557	1000 Order	2500+: $0.3688
568-1099-5-ND	PXAS30KBA,512	NXP USA Inc	View more Series: XA Packaging: Tube Part Status: Obsolete Core Processor: XA Core Size: 16-Bit Speed: 30MHz Connectivity: EBI/EMI, IC, UART/USART Peripherals: PWM, WDT Number of I/O: 50 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23) Base Part Number: PXAS3	1000 Order	1+: $0
568-1303-ND	PXAS30KBBE,557	NXP USA Inc	View more Series: XA Packaging: Tray Part Status: Obsolete Core Processor: XA Core Size: 16-Bit Speed: 30MHz Connectivity: EBI/EMI, IC, UART/USART Peripherals: PWM, WDT Number of I/O: 50 Program Memory Type: ROMless RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: PXAS3	1000 Order	1+: $0

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