Nxp timing buffer - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
IMX-MIPI-HDMI-N D	IMX-MIPI-HDMI	NXP USA Inc	View more Series: * Part Status: Active	1 Order	1+: $99.7353
LFSMPBS12XSFM-N D	LFSMPBS12XSFM	NXP USA Inc	View more Part Status: Active Accessory Type: Daughter Board For Use With/Related Products: EVB9S12XEP100	1000 Order	1+: $167.347
568-13477-ND	CWA-LS-DVLPR-NL	NXP USA Inc	View more Series: CodeWarrior Part Status: Active Type: Integrated Development Environment (IDE) Applications: Programming Edition: Developer License Length: 1 Year License - User Details: Floating Node Operating System: Linux, Windows For Use With/Related Products: Code Warrior Software	1 Order	1+: $1.89
CWH-CTP-COP-YE- ND	CWH-CTP-COP-YE	NXP USA Inc	View more Series: CodeWarrior Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Accessory Type: Interface Board Moisture Sensitivity Level (MSL): 1 (Unlimited) For Use With/Related Products: CodeWarrior Tap	58 Order	1+: $39.4947
PDTA123EK,115-N D	PDTA123EK,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1): 2.2 kOhms Resistor - Emitter Base (R2): 2.2 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500A, 10mA Current - Collector Cutoff (Max): 1A Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK Base Part Number: PDTA123	1000 Order	1+: $0
PDTB123TS,126-N D	PDTB123TS,126	NXP USA Inc	View more Packaging: Tape & Box (TB) Part Status: Obsolete Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1): 2.2 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3 Base Part Number: PDTB123	1000 Order	1+: $0
MC9S08PA4VTGR-N D	MC9S08PA4VTGR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	1000 Order	5000+: $0.31
MC9S08QG4CDNER- ND	MC9S08QG4CDNER	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	2500+: $0.863
MKE02Z32VLD2R-N D	MKE02Z32VLD2R	NXP USA Inc	View more Series: Kinetis KE02 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 20MHz Connectivity: IC, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	1000 Order	1500+: $0.9437
S9S08SG8E2MTJR- ND	S9S08SG8E2MTJR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP Base Part Number: S9S08SG8	1000 Order	--
MC908QB4CDWER-N D	MC908QB4CDWER	NXP USA Inc	View more Series: HC08 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC Base Part Number: MC908QB4	1000 Order	1000+: $1.4703
S9S08EL16F1MTLR -ND	S9S08EL16F1MTLR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	1000 Order	5000+: $1.9104
S9S12P128J0VFT- ND	S9S12P128J0VFT	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: S9S12P128	1000 Order	1300+: $2.1943
MC9S08GT8AMFDE- ND	MC9S08GT8AMFDE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MC9S08GT8	1000 Order	260+: $2.5524
S9S12G128AMLF-N D	S9S12G128AMLF	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Controller Series: Microcontrollers - MCU Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Voltage - Supply: -40C ~ 125C Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: S9S12	22680 Order	--
568-11347-ND	LPC1548JBD64QL	NXP USA Inc	View more Series: LPC15xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 44 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $3.2386
MK10DN512ZVLK10 -ND	MK10DN512ZVLK10	NXP USA Inc	View more Series: Kinetis K10 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SD, SPI, UART/USART Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 37x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: MK10DN512	1000 Order	--
MK40DX256VLL7-N D	MK40DX256VLL7	NXP USA Inc	View more Series: Kinetis K40 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LCD, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 34x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: MK40DX256	1000 Order	--
S912XET512BCAGR -ND	S912XET512BCAGR	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	500+: $7.4359
MK27FN2M0AVMI15 -ND	MK27FN2M0AVMI15	NXP USA Inc	View more Series: Kinetis K27F Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, IC, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, IS, PWM, WDT Number of I/O: 120 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b Oscillator Type: Internal/External Operating Temperature: -40C ~ 105C (TA) Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (9x9)	1000 Order	260+: $10.0311
MC68HC11E0CFNE3 -ND	MC68HC11E0CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	23+: $10.5783
SP5745CBK1AVMH6 R-ND	SP5745CBK1AVMH6 R	NXP USA Inc	View more Series: MPC57xx Part Status: Active Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, IC, LINbus, SPI Peripherals: DMA, IS, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA)	1000 Order	1500+: $10.9514
SPC5604SF2CLQ6- ND	SPC5604SF2CLQ6	NXP USA Inc	View more Series: MPC56xx Qorivva Packaging: Tray Part Status: Active Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, IC, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 105 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	60+: $11.5668
SPC5644CAVLU1R- ND	SPC5644CAVLU1R	NXP USA Inc	View more Series: MPC56xx Qorivva Packaging: Tape & Reel (TR) Part Status: Active Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, IC, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	1000 Order	500+: $15.997
MPC5553MVR132-N D	MPC5553MVR132	NXP USA Inc	View more Series: MPC55xx Qorivva Packaging: Tray Part Status: Active Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27) Base Part Number: PC5553	1000 Order	--
SAA7105E/V1/G,5 18-ND	SAA7105E/V1/G,5 18	NXP USA Inc	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Obsolete Moisture Sensitivity Level (MSL): 3 (168 Hours) Type: Video Encoder Applications: TV Voltage - Supply, Analog: 3.15 V ~ 3.45 V Voltage - Supply, Digital: 3.15 V ~ 3.45 V Mounting Type: Surface Mount Package / Case: 156-LBGA Supplier Device Package: 156-LBGA (15x15) Base Part Number: SAA7105	1000 Order	1+: $0
MC68882EI16A-ND	MC68882EI16A	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: Floating-Point Co-Processor Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MC68882	1000 Order	--
MPC184VFB-ND	MPC184VFB	NXP USA Inc	View more Series: * Part Status: Obsolete Type: Security Processor Mounting Type: Surface Mount Package / Case: 252-BGA Supplier Device Package: 252-MAPBGA (21x21) Base Part Number: MPC184	1000 Order	--
MMPF0100FDAEPR2 -ND	MMPF0100FDAEPR2	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	4000+: $1.5057
MC34PF3001A3EP- ND	MC34PF3001A3EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Processor Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	315 Order	1+: $2.9673 10+: $2.6643 100+: $2.1828 500+: $1.8582 1000+: $1.5671
568-13811-ND	MC33FS6502LAE	NXP USA Inc	View more Series: * Packaging: Tray Part Status: Active Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	140 Order	1+: $5.3109 10+: $4.7949 100+: $3.9698 500+: $3.4568 1000+: $3.0108
568-13692-ND	MC35FS6500CAE	NXP USA Inc	View more Series: Automotive, AEC-Q100 Packaging: Tray Part Status: Active Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40C ~ 150C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MC35FS6500	2500 Order	--
568-14226-2-ND	MC33689DPEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Interface: SPI Serial Voltage - Supply: 5.5 V ~ 18 V Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC Mounting Type: Surface Mount Base Part Number: MC33689	1000 Order	1000+: $1.3006 2000+: $1.2356
568-8754-2-ND	TJA1082TT,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Interface: FlexRay Voltage - Supply: 4.75 V ~ 5.25 V Package / Case: 14-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 14-TSSOP Mounting Type: Surface Mount Base Part Number: TJA1082	1000 Order	2500+: $0.941
TDA18287HN/C1E- ND	TDA18287HN/C1E	NXP USA Inc	View more Series: * Part Status: Obsolete	1000 Order	1+: $0
UJA1066TW/3V3/T -ND	UJA1066TW/3V3/T	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Networking Interface: SPI Voltage - Supply: 3.3 V ~ 5 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount Base Part Number: UJA1066	1000 Order	1100+: $1.3178
MCZ33903DP5EKR2 -ND	MCZ33903DP5EKR2	NXP USA Inc	View more Part Status: Active Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V	1000 Order	1000+: $1.6934
MCZ33903DS5EK-N D	MCZ33903DS5EK	NXP USA Inc	View more Part Status: Active Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V	1000 Order	--
SFR4310E1MAE40R -ND	SFR4310E1MAE40R	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	1500+: $8.6178
74LVT00D,118-ND	74LVT00D,118	NXP USA Inc	View more Series: 74LVT Packaging: Tape & Reel (TR) Part Status: Obsolete Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Voltage - Supply: 2.7 V ~ 3.6 V Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width) Base Part Number: 74LVT00	1000 Order	1+: $0

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